Metal Casing Stacked Package Heat Dissipation

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional stacked package structures suffer from inadequate heat dissipation and structural strength due to polymer-based encapsulation, and lack EMI shielding functionality as they do not have a metal layer covering the outer longitudinal portions.

Innovation Solution

A stacked package structure featuring a metal casing with a stacked chipset, encapsulation, and a redistribution layer, where the chipset is adhered to the metal casing, and the encapsulation exposes metal pads for connection to the redistribution layer, enhancing heat dissipation and structural strength, and utilizing the metal casing for EMI shielding when connected to system power.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If polymer-based encapsulation is used, then the encapsulation process is simple, but heat dissipation efficiency is poor and structural strength is low

Engineering Contradiction:

Improveencapsulation process simplicityVSAvoidheat dissipation efficiency

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The patent applies composite materials by combining polymer encapsulation material with metal materials (such as aluminum or copper layers) to form a hybrid encapsulation structure. The polymer provides ease of manufacturing and protection, while the metal components provide superior heat dissipation efficiency and structural strength, resolving the contradiction between manufacturing simplicity and thermal performance.

Inventive Principle:

Principle #40Composite materials

2Ease of manufacture

If polymer-based encapsulation is used, then the encapsulation process is simple, but structural strength is low

Engineering Contradiction:

Improveencapsulation process simplicityVSAvoidstructural strength

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The patent uses composite materials by integrating metal layers (aluminum or copper) with polymer encapsulation material. The metal provides high structural strength and rigidity, while the polymer maintains ease of manufacturing and processing, thus resolving the contradiction between manufacturing simplicity and structural strength.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent applies local quality by placing metal reinforcement layers specifically at critical stress-bearing regions or outer surfaces of the encapsulation, while using polymer material in regions where flexibility and ease of manufacturing are more important. This localized material distribution optimizes both structural strength and manufacturing ease.

Inventive Principle:

Principle #3Local quality

3Device complexity

If no metal layer covers outer longitudinal portion, then the structure is simpler, but EMI shielding function is lacking

Engineering Contradiction:

Improvestructural complexityVSAvoidEMI shielding function

Core Design Contradiction:

Device complexityVSObject-affected harmful factors

Solution Approach 1:

The patent applies composite materials by combining polymer encapsulation with metal shielding layers. The metal layers (aluminum or copper) provide effective EMI shielding by blocking electromagnetic interference, while the polymer base material maintains relative structural simplicity and ease of manufacturing, resolving the contradiction between device complexity and EMI shielding functionality.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly improves heat dissipation and structural strength while providing EMI shielding functionality to the stacked package structure.

Implementation Method 1

the stacked package structure has a metal casing, a stacked chipset, an encapsulation and a redistribution layer. The stacked chipset is adhered in the metal casing... the stacked package structure of the present invention includes the metal casing, so an efficiency of heat dissipation and structural strength are increased

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the stacked package structure has a metal casing, a stacked chipset, an encapsulation and a redistribution layer. The stacked chipset is adhered in the metal casing... an efficiency of heat dissipation and structural strength are increased

Methodology Applied

Scientific EffectMechanical support: Mechanical Force

Implementation Method 3

utilizing the metal casing for EMI shielding when connected to system power

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 4

The stacked chipset is adhered in the metal casing

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS10892250B2Stacked package structure with encapsulation and redistribution layer and fabricating method thereof

Publication Date: 2021.01.12 POWERTECH TECHNOLOGY INC

AI summary

A stacked package structure has a metal casing, a stacked chipset, an encapsulation and a redistribution layer. The stacked chipset is adhered in the metal casing. The encapsulation is formed in the metal casing to encapsulate the stacked chip set, but a plurality of surfaces of the metal pads are exposed through the encapsulation. The redistribution layer is further formed on the encapsulation and electrically connects to the metal pads of the stacked chipset. Therefore, the stacked package structure includes the metal casing, so an efficiency of heat dissipation and structural strength are increased.