Metal-Ceramic Substrate Laser Ablation Without Metal Deposits
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Laser cutting of metal-ceramic substrates often results in undesirable metal deposits near the cutting line, leading to reduced electrical insulation and mechanical instability, particularly in DCB substrates used for power electronics, which can cause delamination and crack formation.
Innovation Solution
A method using a p-sec laser with specific power and processing speed conditions to minimize metal particle deposition during laser ablation, ensuring stable insulation and mechanical stability by maintaining a flush edge and avoiding the formation of solid metal particles near the ablation edge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional laser cutting is used on metal-ceramic substrates, then material separation is achieved, but metal deposits form near the cutting line reducing electrical insulation
Solution Approach 1:
The patent applies parameter changes by optimizing laser power, pulse duration, and scanning speed to prevent metal particle deposition. Specifically, using pulsed laser radiation with controlled energy density and temporal parameters prevents the formation of solid metal particles that would otherwise deposit on the substrate surface near the ablation zone.
Solution Approach 2:
The patent employs periodic action through pulsed laser radiation instead of continuous laser beam. The pulsed regime allows controlled ablation of metal layers and ceramic substrates while preventing excessive heat accumulation and metal particle formation between pulses, thereby eliminating deposit formation.
2Ease of manufacture
If metal coating is etched away before laser ablation, then recesses can be formed, but the process requires two steps increasing complexity
Solution Approach 1:
The patent merges the metal layer removal and ceramic substrate ablation into a single laser processing step. By optimizing laser parameters, the method enables direct ablation of both metal coating and ceramic substrate simultaneously, eliminating the need for separate etching and ablation steps.
Solution Approach 2:
The patent extracts the metal layer removal step from the conventional two-step process. Instead of requiring preliminary etching, the optimized laser parameters enable direct ablation of the metal coating along with the ceramic substrate, taking out the intermediate etching operation entirely.
3Manufacturing precision
If metal edge is set back relative to ceramic edge, then recesses are formed, but mechanical stability decreases leading to delamination
Solution Approach 1:
The patent uses parameter changes in laser processing to achieve flush edges between metal and ceramic. By controlling laser power, pulse duration, and scanning speed, the method removes metal and ceramic at comparable rates, producing edges that are substantially flush with each other rather than setback, thereby maintaining mechanical stability.
4Productivity
If laser power is increased to improve processing speed, then productivity increases, but metal particle formation increases
Solution Approach 1:
The patent employs periodic pulsed laser action to decouple processing speed from particle formation. By using high-frequency pulses with controlled duration and energy, the system achieves high productivity through rapid sequential ablation while preventing the continuous heat input that would cause excessive metal particle generation.
Solution Approach 2:
The patent applies parameter changes by optimizing the relationship between pulse duration, frequency, and energy density. This allows high processing speeds through efficient material removal while maintaining energy levels below the threshold for excessive particle generation and deposition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves stable electrical insulation and mechanical stability in metal-ceramic substrates, preventing delamination and crack formation, while also reducing the economic burden of a two-step process by allowing simultaneous laser ablation of metal and ceramic substrates.
Implementation Method 1
laser ablation of a metal-ceramic substrate
Implementation Method 2
laser radiation through material ablation
Implementation Method 3
separation of solids by means of continuous or pulsed laser radiation through material ablation
Data Source
Figure 1
AI summary
The present application relates to a method of laser ablation of a metal-ceramic substrate, in which a laser is used under process conditions in which the formation of solid metal particles on the metal-ceramic substrate, which can separate from metal particles released by laser ablation near the ablation edge, is essentially avoided. Further the present application relates to a ceramic-metal substrate comprising a ceramic substrate and a metallization on at least one side of the ceramic substrate, wherein the ceramic substrate and the metallization have flush cutting edge.