Metal-Ceramic Breaking Recess Profile for Precise Substrate Separation
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Solution Overview
Problem
Existing methods for producing predetermined breaking recesses in metal-ceramic substrates, particularly in large cards, often result in inaccurate breaking and instability during transport, leading to a high rate of rejects due to unintended breaking.
Innovation Solution
A method involving the creation of breaking recesses with modulated depths, where a first section and a second section have different depths, and the bottom of the recess is structured with specific inclinations to ensure accurate breaking and stability, using ultra-short pulse lasers and temperature control to minimize thermomechanical stresses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a predetermined breaking recess is formed with uniform depth, then the breaking process is simple, but the substrate exhibits instability during transport and inaccurate breaking
Solution Approach 1:
The patent applies local quality by varying the depth of the breaking recess along its length, creating first sections with a first depth and second sections with a second depth. This non-uniform depth profile provides different mechanical properties at different locations, ensuring stable transport while enabling accurate breaking at the desired position.
2Manufacturing precision
If the breaking recess has modulated depth with first and second sections, then breaking accuracy and transport stability improve, but the manufacturing process becomes more complex
Solution Approach 1:
The patent employs periodic action by using pulsed laser irradiation to create the modulated depth structure. The laser is applied in a periodic pattern with different pulse numbers or energies for first sections versus second sections, efficiently creating the complex depth profile without requiring mechanically complex processing equipment.
3Manufacturing precision
If laser processing is used to create breaking recesses, then precision is improved, but thermomechanical stresses may cause unintended breaking
Solution Approach 1:
The patent applies continuity of useful action by performing immediate temperature treatment directly after laser processing while the substrate is still in the processing chamber. This continuous process prevents thermal shock from rapid temperature changes and eliminates the need for separate handling steps that could induce unintended breaking.
4Reliability
If multiple process steps are used to create modulated breaking recesses, then breaking behavior is optimized, but production time increases
Solution Approach 1:
The patent merges multiple process steps into a single integrated operation. The laser processing unit performs both the breaking recess formation and the temperature treatment in one continuous process, eliminating intermediate steps and significantly improving production efficiency while maintaining optimized breaking behavior.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise and stable breaking of metal-ceramic substrates, reducing rejects and enhancing handling and transport safety by optimizing the fracture behavior and thermal shock resistance.
Implementation Method 1
the metal-ceramic substrate is irradiated with ultrashort pulse laser light
Implementation Method 2
a temperature treatment is performed during the production of the predetermined breaking recess, in particular by means of a heating element
Data Source
Figure 1
Figure 2A~2C
AI summary
The invention relates to a method for processing a metal-ceramic substrate (1), comprising: - providing a metal-ceramic substrate (1) and - forming a predetermined breaking recess (7) in the metal-ceramic substrate (1), the predetermined breaking recess (7) having along its direction of extension (V) a first portion (A1) with a first depth (T1) and a second portion (A2) with a second depth (T2), wherein a second depth (T2) is achieved, which differs from the first depth (T1).