Metal-Ceramic Composite Thermal Spreader with Oxide Interface
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Solution Overview
Problem
Densely packed electronic circuitry in portable devices generates excessive heat, leading to elevated temperatures in device housings, causing user discomfort and reduced consumer satisfaction.
Innovation Solution
The use of metal-ceramic composite structures with a metal oxide interface, where the composite member provides mechanical stability and efficient heat transport, while the oxide layer mitigates heat flow, forming a spreader plate that is mechanically stable and lightweight, with thermal conductivities optimized to direct heat parallel to the interface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If densely packed electronic circuitry is used to increase functionality, then device functionality is improved, but heat generation increases causing elevated housing temperatures
Solution Approach 1:
The solid structure segments the thermal management function into distinct regions: a first portion with high thermal conductivity for heat collection, and a second portion with low thermal conductivity for heat isolation. This segmentation allows the device to maintain high functionality while directing heat away from the housing.
Solution Approach 2:
Different portions of the solid structure have different thermal conductivity properties tailored to their specific functions. The first portion (in contact with heat sources) has high thermal conductivity to efficiently collect heat, while the second portion (near housing) has low thermal conductivity to prevent heat transfer to the housing.
2Temperature
If conventional thermal management materials are used, then heat dissipation is achieved, but mechanical stability and lightweight properties are compromised
Solution Approach 1:
The solid structure employs composite materials with tailored thermal properties. The combination of materials provides both the required thermal management performance (high heat dissipation capability) and mechanical stability, while maintaining a lightweight profile suitable for portable devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages heat dissipation in portable electronic devices by reducing heat transfer to the housing, preventing hot spots and improving user experience through efficient thermal conductivity and mechanical stability.
Implementation Method 1
The metal-ceramic composite can have a first thermal conductivity and a plurality of surfaces. In certain embodiments, at least one of the plurality of surface can be a substantially planar surface. The first thermal conductivity of the metal-ceramic composite can be greater than the second thermal conductivity of the metal oxide member. Such relationship between thermal conductivities can permit the solid structures to transport heat from the heat source substantially along a direction substantially parallel to the interface.
Implementation Method 2
The metal oxide member can have one or more thicknesses and can have a second thermal conductivity. In one aspect, the first thermal conductivity of the metal-ceramic composite can be greater than the second thermal conductivity of the metal oxide member. Such relationship between thermal conductivities can permit the solid structures to transport heat from the heat source substantially along a direction substantially parallel to the interface.
Data Source
AI summary
Solid structures for thermal management are provided. In one aspect, the solid structures can comprise a metal-ceramic composite member assembled to be in thermal contact with a heat source. The metal-ceramic composite member can be mechanically coupled to an assembly (e.g., an electronic assembly) containing the heat source, and can provide mechanical stability to such assembly. In another aspect, the solid structures can comprise an oxide member that covers a surface of the metal-ceramic composite member, forming a metal-ceramic-oxide interface at the surface. The thickness of the oxide member combined with the magnitude of its thermal conductivity relative to the thermal conductivity of the metal-ceramic composite member can permit heat transport substantially along a direction substantially parallel to the metal-ceramic-oxide interface, and can reduce heat transfer through such interface.