Metal-Ceramic Substrate Laser Cutting With Flush Ablation Edges
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Solution Overview
Problem
Laser cutting of metal-ceramic substrates often results in particulate emissions, leading to undesirable metal deposits near the cutting line, which can reduce electrical insulation and cause delamination and mechanical instability, especially in DCB substrates used for power electronics, requiring a more stable and economically viable method.
Innovation Solution
A method using a laser under specific process conditions to avoid the formation of solid metal particles near the ablation edge, allowing for simultaneous laser ablation of both the metal and ceramic substrates, resulting in a metal-ceramic substrate with stable insulation and mechanical stability, achieved through the use of a p-sec IR laser with controlled pulse duration and processing speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional laser cutting is used on metal-ceramic substrates, then material separation is achieved, but metal particles are deposited near the cutting line reducing electrical insulation
Solution Approach 1:
The patent changes the laser processing parameters by using pulsed laser radiation with specific pulse durations (nanosecond to picosecond range) and fluence levels (10-1000 mJ/cm²) to ablate metal layers without generating excessive metal particles that would deposit near the cutting line
Solution Approach 2:
The patent employs pulsed laser radiation instead of continuous wave laser, using periodic pulses with controlled duration and frequency to remove material while minimizing particle generation and deposition near the ablation zone
2Ease of manufacture
If metal coating is etched away before laser ablation, then recesses are created, but the process requires two steps increasing complexity
Solution Approach 1:
The patent combines the metal layer removal and ceramic substrate ablation into a single laser processing step, eliminating the need for separate etching and ablation steps by using laser parameters that selectively remove both materials simultaneously
3Ease of manufacture
If metal edge is set back relative to ceramic edge, then recesses are formed, but mechanical stability and electrical insulation are reduced
Solution Approach 1:
The patent uses controlled laser fluence and pulse duration parameters to achieve flush edges where the metal layer and ceramic substrate are ablated to the same level, eliminating the setback condition that causes insulation problems while maintaining recess functionality
4Productivity
If high laser power is used for ablation, then processing speed increases, but metal particle formation increases
Solution Approach 1:
The patent uses high-frequency pulsed laser radiation with nanosecond to picosecond pulse durations, delivering high peak power for efficient ablation while the periodic nature of the pulses allows heat dissipation between pulses, preventing excessive melting and particle generation
Solution Approach 2:
The patent optimizes the ratio of pulse duration to pulse frequency, using shorter pulse durations at higher frequencies to maintain high processing speeds while keeping individual pulse energy low enough to avoid excessive particle formation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces metal-ceramic substrates with stable electrical insulation and mechanical stability, reducing delamination and crack formation, while also being economically efficient by eliminating the need for a two-step process and minimizing metal particle deposition.
Implementation Method 1
laser ablation of the metal layer and the ceramic substrate
Implementation Method 2
separation of solids by means of continuous or pulsed laser radiation through material ablation
Data Source
AI summary
The present application relates to a method of laser ablation of a metal-ceramic substrate, in which a laser is used under process conditions in which the formation of solid metal particles on the metal-ceramic substrate, which can separate from metal particles released by laser ablation near the ablation edge, is essentially avoided. Further the present application relates to a ceramic-metal substrate comprising a ceramic substrate and a metallization on at least one side of the ceramic substrate, wherein the ceramic substrate and the metallization have flush cutting edge.