Metal-Ceramic Substrate Laser Scribing for Uniform Breaking
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Solution Overview
Problem
Existing methods for producing metal-ceramic substrates with predetermined breaking lines and separation lines are limited in precision and consistency, leading to potential damage during the breaking process and uneven breaking behavior across the substrate.
Innovation Solution
A method where the metal-ceramic substrate is fixed in a stationary manner using a carrier with a suction device, and an ultra-short pulse laser is moved along the planned breaking lines multiple times, with a processing speed of 0.1-2 m/s, using a pivotable mirror element and a lens with a focal length greater than 300 mm to create precise, vertically aligned breaking lines, minimizing crack formation and ensuring uniform breaking behavior.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the metal-ceramic substrate is moved during laser processing to produce breaking lines, then processing speed can be maintained, but the precision and consistency of the breaking lines deteriorate
Solution Approach 1:
Instead of moving the substrate through the laser beam, the patent inverts the approach by keeping the substrate stationary and moving the laser beam across the substrate surface. This is achieved by mounting the substrate on a stationary carrier while the laser system translates along predetermined paths, thereby maintaining both high precision and productivity.
Solution Approach 2:
The patent introduces a carrier as an intermediary component that holds the metal-ceramic substrate in a stationary position. This carrier acts as a mediator between the substrate and the moving laser system, enabling the substrate to remain fixed while still receiving the laser processing along predetermined breaking lines.
2Manufacturing precision
If the laser beam passes over the metal-ceramic substrate multiple times to create finer structures, then manufacturing precision improves, but processing time increases
Solution Approach 1:
The patent implements continuous multi-pass laser processing where the laser beam traverses the substrate multiple times along the same predetermined paths without interruption. Each pass refines the breaking lines with consistent precision, and the stationary positioning enables seamless repeated passes that collectively create finer structured features while maintaining efficient processing.
3Manufacturing precision
If the substrate is held in a stationary manner during processing, then breaking line precision improves, but device complexity increases due to carrier and suction device
Solution Approach 1:
The carrier system serves multiple functions simultaneously: it holds the substrate stationary, provides suction for positioning and stabilization, and supports the substrate throughout the multi-pass processing. This multi-functional design consolidates several requirements into a single integrated component, reducing overall system complexity despite the added stationary holding capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for finer, more precisely shaped breaking lines with reduced crack formation and consistent breaking behavior across the substrate, ensuring reliable separation without damage and uniformity in breaking properties.
Implementation Method 1
a suction device which fixes the metal-ceramic substrate in the carrier during the process by means of a corresponding negative pressure on the underside of the metal-ceramic substrate
Implementation Method 2
Such a large card is processed using laser light to create predetermined breaking lines and/or separation points. The use of ultra-short pulse lasers has proven to be advantageous
Data Source
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AI summary
The invention relates to a method and a system for machining a metal-ceramic substrate (1), having the steps of: - providing a metal-ceramic substrate (1), and - forming a predetermined breaking line (7) and/or a separating line in order to separate the metal-ceramic substrate (1) using laser light (10) of an ultrashort pulse laser, wherein the metal-ceramic substrate (1) is stationary while forming the predetermined breaking line (7) and/or the separating line, and the laser light (10) for forming the predetermined breaking line (7) and/or the separating line is moved over the metal-ceramic substrate (1), in particular by means of a mirror element (30) and a lens (20) with a long focal length.