Metal-Ceramic Joining Paste for Semiconductor Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for joining metal terminals to ceramic members in semiconductor manufacturing devices face challenges in achieving strong and reliable connections, particularly in maintaining integrity under temperature changes and ensuring effective electrical conductivity.
Innovation Solution
A manufacturing method using a paste containing resin and metal particles with a particle size of 100 nm or less, where the metal fine particles account for 1% or more of the paste's mass, is employed to tightly join metal terminals and ceramic members, incorporating a solvent to improve fluidity and prevent contraction during heat treatment, and utilizing noble metals for enhanced bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a paste containing resin and metal particles is used to join metal terminal and ceramic member, then the joining strength and reliability are improved, but the manufacturing precision and control of paste composition become more difficult
Solution Approach 1:
The patent specifies precise parameter ranges for metal fine particle content (1-50 mass%) and metal coarse particle content (50-99 mass%) in the paste composition. By controlling these compositional parameters within defined ranges, the invention achieves reliable joining while maintaining manufacturability. The parameter optimization balances bonding strength from fine particles with structural integrity from coarse particles.
Solution Approach 2:
The invention uses a composite paste material containing both metal fine particles (≤100 nm) and metal coarse particles (0.5-10 μm) combined with resin. This composite structure leverages the high surface area and reactivity of fine particles for strong bonding while utilizing coarse particles for structural framework, achieving both reliability and manufacturability through material composition design.
2Strength
If metal fine particles with particle size of 100 nm or less are used in the paste, then the bonding strength and electrical conductivity are improved, but the paste stability and handling become more difficult
Solution Approach 1:
The patent introduces resin as an intermediary material that binds the metal fine particles and coarse particles together in a stable paste formulation. The resin prevents aggregation of ultrafine metal particles during storage and application, making the paste easy to handle while maintaining the bonding advantages of fine particles. The resin acts as a matrix that suspends and distributes the metal particles uniformly.
3Reliability
If a paste with high metal particle content is used to ensure electrical conductivity, then the electrical conductivity is improved, but the paste fluidity and application become more difficult
Solution Approach 1:
The patent creates local quality differentiation within the paste by using bimodal particle size distribution. Metal fine particles (≤100 nm) provide localized electrical conductivity pathways and bonding strength at the interface, while metal coarse particles (0.5-10 μm) provide structural framework and maintain paste fluidity. This local quality assignment allows high electrical conductivity without sacrificing ease of application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves a strong, reliable, and tightly bonded connection between metal terminals and ceramic members, improving the structural integrity and electrical conductivity while maintaining reliability across temperature variations.
Implementation Method 1
the metal fine particles, together with a resin, penetrate into a recess or the like that is present on a surface of the ceramic member and it is possible to join the metal terminal and the ceramic member tightly
Data Source
AI summary
In a manufacturing method for a member for a semiconductor manufacturing device, a metal terminal and a ceramic member are joined by using a paste that contains a resin and a metal particle(s), and a metal fine particle(s) that has/have a particle size(s) of 100 nm or less in the metal particle(s) account(s) for 1% by mass or more of 100% by mass of the metal particle(s). A member for a semiconductor manufacturing device includes a metal terminal, a ceramic member, and a joining part that connects the metal terminal and the ceramic member. The joining part contains a metal particle(s).