Metal-Ceramic Substrate Insert for Printed Circuit Board Thermal Management
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Solution Overview
Problem
Conventional printed circuit boards made of plastic, epoxy resin, and hard paper have limited thermal conductivity and insulation capabilities, making them unsuitable for high-performance electronic components that generate significant heat, while metal-ceramic substrates offer better thermal conductivity but are complex and costly to produce.
Innovation Solution
A printed circuit board design incorporating a metal-ceramic substrate insert embedded within a base body made of cost-effective materials like fiber-reinforced plastic, with a positive connection to enhance thermal conductivity and insulation, and a method for producing such substrates involving profiling and integration to match thermal expansion coefficients and ensure mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional materials (plastic, epoxy resin, laminated paper) are used for the entire circuit board, then cost-effectiveness and ease of manufacturing are improved, but thermal conductivity and insulation capabilities deteriorate
Solution Approach 1:
The circuit board combines conventional base body materials (plastic, epoxy resin, or laminated paper) with a metal-ceramic substrate insert to create a composite structure. This allows the majority of the board to use cost-effective conventional materials while a localized metal-ceramic insert provides high thermal conductivity and insulation capabilities where needed, resolving the contradiction between manufacturing ease and thermal performance.
Solution Approach 2:
The metal-ceramic substrate is strategically positioned in specific regions of the circuit board where high thermal conductivity is required, such as beneath heat-generating electronic components. This localized application of premium material optimizes thermal management performance while minimizing cost increases, as the expensive metal-ceramic substrate constitutes less than 30% of the total board structure.
2Temperature
If metal-ceramic substrate is used for the entire circuit board, then thermal conductivity and insulation properties are improved, but manufacturing complexity and cost increase
Solution Approach 1:
The circuit board is segmented into two functional zones: a conventional base body that provides mechanical support and electrical insulation, and a localized metal-ceramic substrate insert that provides enhanced thermal conductivity. This segmentation allows each material to be optimized for its specific function and manufactured using appropriate processes, reducing overall manufacturing complexity compared to producing an entire metal-ceramic board.
Solution Approach 2:
The metal-ceramic substrate is applied locally only where high thermal performance is required, rather than throughout the entire board. This localized quality approach reduces the amount of complex metal-ceramic material needed, simplifying manufacturing processes and reducing costs while still achieving the required thermal conductivity improvements in critical areas.
3Temperature
If metal-ceramic substrate insert is embedded in conventional base body, then thermal conductivity is improved locally, but mechanical stresses from thermal expansion differences may increase
Solution Approach 1:
A transition layer or intermediate structure is provided between the metal-ceramic substrate insert and the conventional base body. This intermediary layer acts as a buffer that accommodates differences in thermal expansion coefficients between the two materials, reducing mechanical stresses and preventing delamination or cracking during thermal cycling, thus resolving the contradiction between thermal performance and mechanical stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases thermal conductivity and insulation capabilities while maintaining cost-effectiveness, preventing mechanical stresses and ensuring reliable heat dissipation and electrical insulation, thus addressing the limitations of conventional circuit boards.
Implementation Method 1
the insert is a metal-ceramic substrate and interacts positively and preferably materially with the base body in a direction perpendicular to the main extension plane
Implementation Method 2
The electrical circuits are preferably formed on one component side of the printed circuit board
Data Source
Figure 1
Figure 2a~2d
Figure 2e~2g
AI summary
The invention relates to a printed circuit board (100) for electrical components (5) and/or conductor tracks (4), comprising - a base body (2) which extends along a main extension plane (HSE), and - an insert (1) which is integrated into the base body (2), wherein the insert (1) is a metal-ceramic substrate (10) and cooperates with the base body (2) in a form-fitting and preferably a bonded manner in a direction that is perpendicular to the main extension plane (HSE).