Metal-Ceramic Substrate Insert for Printed Circuit Board Thermal Management
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Solution Overview
Problem
Conventional printed circuit boards made from materials like plastic, epoxy resin, and hard paper have limited thermal conductivity and insulation capabilities, making them unsuitable for high-performance electronic components that generate significant heat.
Innovation Solution
A printed circuit board design that incorporates a metal-ceramic substrate as an insert, which is embedded in a base body made from cost-effective materials like plastic or epoxy resin. The metal-ceramic substrate is partially or fully surrounded by an insulating element to enhance insulation and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional materials (plastic, epoxy resin, hard paper) are used for printed circuit boards, then cost-effectiveness and ease of manufacture are improved, but thermal conductivity and insulation capability deteriorate
Solution Approach 1:
The patent employs a composite structure combining a metal-ceramic substrate insert with a conventional plastic base body. The metal-ceramic substrate provides high thermal conductivity and insulation capability, while the plastic base body maintains cost-effectiveness and ease of manufacture. This composite approach allows the printed circuit board to achieve superior thermal management properties without completely abandoning conventional manufacturing processes.
2Temperature
If metal-ceramic substrates are used for printed circuit boards, then thermal conductivity and insulation capability are improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent divides the printed circuit board into two separate components: a metal-ceramic substrate insert and a plastic base body. The metal-ceramic substrate is manufactured separately as an insert component, allowing specialized high-performance manufacturing processes to be applied only where needed, while the base body can be produced using conventional, simpler processes. This segmentation reduces overall manufacturing complexity compared to producing an entire board from expensive metal-ceramic materials.
Solution Approach 2:
The metal-ceramic substrate insert is embedded within the plastic base body, creating a nested structure where the high-performance insert is housed within the conventional outer structure. This nesting approach allows the complex metal-ceramic component to be integrated into a simpler overall system, reducing manufacturing complexity while maintaining the thermal benefits.
3Reliability
If metal-ceramic substrates are used for printed circuit boards, then insulation capability is improved, but manufacturing cost increases
Solution Approach 1:
The patent applies the expensive, high-performance metal-ceramic material only in specific localized areas where high insulation capability and thermal management are critical, rather than throughout the entire printed circuit board. The plastic base body is used in areas where such high performance is not required, maintaining cost-effectiveness. This local quality approach ensures that expensive materials are used only where they provide the most value.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively addresses the thermal management and insulation challenges of conventional printed circuit boards by providing enhanced thermal conductivity and insulation capabilities while maintaining cost-effectiveness and ease of production.
Implementation Method 1
the metal-ceramic substrate is covered, in particular surrounded, at least partially by an insulating element on a side surface facing the base body in the assembled state
Implementation Method 2
the metal-ceramic substrate is covered, in particular surrounded, at least partially by an insulating element on a side surface facing the base body in the assembled state
Data Source
AI summary
Printed circuit board (100) for electrical components (5) and/or conductor paths (4), comprising:a base body (2) which extends along a main extension plane (HSE), andan insert (1) which is integrated into the base body (2) in the assembled state,wherein the insert (1) is a metal-ceramic substrate (10), the metal-ceramic substrate (1) being covered, in particular surrounded, at least partially by an insulating element (8) on a side surface (SF) facing the base body (2) in the assembled state.