Metal-Ceramic Substrate Silver Contact Patterning Without Masking
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Solution Overview
Problem
Existing methods for producing metal-ceramic substrates with a structuring and silver-containing contact area are technically demanding and prone to defects due to the masking and removal processes involved.
Innovation Solution
A method for producing a metal-ceramic substrate involving structuring a metal layer, depositing a silver-containing layer, and selectively removing it without the need for masking, using techniques like etching and ultrashort pulse laser ablation to create a silver contact area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If masking and removal processes are used to create silver contact areas, then silver-containing contact areas can be formed, but the production process becomes technically demanding and defect-prone
Solution Approach 1:
The patent extracts and eliminates the masking step from the production process. Instead of applying a mask to protect areas, the invention directly deposits silver only in the desired contact area patterns through selective deposition techniques, thereby removing the source of defects associated with mask application and removal while simplifying the overall process
Solution Approach 2:
The patent performs preliminary structuring of the metal layer before silver deposition. By pre-structuring the metal layer with the desired contact area patterns, the subsequent silver deposition can be selectively applied only to these pre-defined areas, eliminating the need for masking and reducing process complexity
2Manufacturing precision
If masking processes are used to create structured contact areas, then silver contact areas can be formed, but defects frequently occur in the finished substrate
Solution Approach 1:
The invention removes the masking process entirely from the production flow. By using selective deposition methods that deposit silver only in predetermined contact areas without requiring masks, the patent eliminates the defect sources associated with mask application, pattern transfer, and mask removal, thereby improving substrate reliability
Solution Approach 2:
The patent employs self-aligned deposition techniques where the silver is deposited selectively based on the pre-structured metal layer geometry or through localized deposition conditions. This self-service approach eliminates the need for external masking and ensures precise contact area formation without introducing mask-related defects
3Manufacturing precision
If chemical masking agents are used in the production process, then contact areas can be defined, but environmental contamination occurs
Solution Approach 1:
The patent extracts and eliminates chemical masking agents from the production process. By replacing mask-based methods with selective deposition techniques that use physical or controlled chemical processes directly on the substrate, the invention removes the source of environmental contamination while maintaining precise area definition capability
Solution Approach 2:
The patent replaces chemical masking processes with physical or controlled deposition methods. By using techniques such as selective sputtering, evaporation, or localized chemical vapor deposition that rely on physical field control rather than chemical masks, the invention eliminates harmful chemical agents while achieving precise contact area definition
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the production process, reduces defects, and avoids environmental contamination from chemical masking agents, resulting in a reliable silver contact area for semiconductor attachment.
Implementation Method 1
b) structuring the metal layer
Implementation Method 2
c) depositing a silver-containing layer on the structured metal layer
Implementation Method 3
The contact area is formed by ablation of the silver-containing layer in sections by a pulsed laser beam of an ultrashort pulse laser
Data Source
AI summary
The invention relates to a method for producing a metal-ceramic substrate having a structure and a contact area containing silver, and to a metal-ceramic substrate. The method comprises the steps: a) providing a metal-ceramic substrate comprising a1) a ceramic body and a2) a metal layer bonded to the ceramic body over a surface area, b) structuring the metal layer, c) depositing a silver-containing layer onto the structured metal layer, and d) selectively removing the silver-containing layer.