Metal-Ceramic Substrate Cooling Structure With Redirected Fluid Flow
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Solution Overview
Problem
Current cooling systems for metal-ceramic substrates, particularly those with semiconductor components like SiC or GaN, face limitations in cooling performance and dimension constraints, necessitating an enhancement in heat dissipation efficiency.
Innovation Solution
A cooling system featuring a metallic structure with integrated fluid channels and a plastic distribution structure that guides the fluid from the inlet to the component side, ensuring controlled flow direction, turbulence creation, and homogeneous temperature distribution, while preventing counterflow and re-use of cooled fluid, utilizing a U-shaped fluid channel configuration and offset openings to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling structures are used for metal-ceramic substrates with semiconductor components, then basic cooling function is provided, but cooling performance is insufficient and dimension constraints occur
Solution Approach 1:
The cooling structure is divided into multiple functional layers: a distribution structure made of plastic material that distributes coolant, and a metallic cooling structure with integrated fluid channels. This segmentation allows each layer to be optimized independently for its specific function, improving overall cooling performance while managing complexity through modular design
Solution Approach 2:
The distribution structure and cooling structure are merged into an integrated assembly where the distribution structure is positioned adjacent to the metallic cooling structure. This merging enables direct thermal coupling and efficient heat transfer from the metal-ceramic substrate through both structures, enhancing cooling effectiveness
2Loss of energy
If fluid channels are integrated into the cooling structure, then heat dissipation efficiency is improved, but fluid flow control and temperature uniformity become challenging
Solution Approach 1:
The distribution structure incorporates multiple distribution channels with varying geometries and positions tailored to specific local heat generation zones on the metal-ceramic substrate. This local quality approach ensures that coolant is delivered precisely where heat dissipation is most critical, achieving uniform temperature distribution across the substrate surface
Solution Approach 2:
The design incorporates feedback mechanisms through the interplay between the distribution channels and cooling channels, where coolant flow patterns and temperature distribution are continuously optimized. The structured arrangement of channels creates self-regulating flow patterns that maintain temperature uniformity across different operating conditions
3Productivity
If cooling performance is enhanced for high-power semiconductor components, then heat dissipation capacity increases, but the system becomes more complex and difficult to manufacture
Solution Approach 1:
The distribution structure serves multiple functions simultaneously: it distributes coolant to various zones, provides thermal coupling to the metal-ceramic substrate, and acts as a structural support element. This multi-functionality enhances heat dissipation capacity while avoiding the need for additional separate components, thereby simplifying manufacturing
Solution Approach 2:
The cooling system employs composite material construction with the distribution structure made of plastic material and the cooling structure made of metallic material. This composite approach combines the advantages of both materials: plastic for ease of manufacturing complex channel geometries and metallic for superior thermal conductivity, achieving high heat dissipation capacity while maintaining manufacturing feasibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system significantly improves cooling performance by ensuring efficient fluid guidance, creating turbulence, and maintaining uniform temperature across the cooling side, thus effectively managing heat dissipation and preventing thermal distortion in metal-ceramic substrates.
Implementation Method 1
the fluid channel is configured such that, when the cooling structure is installed, the fluid is guided from the inlet opening in the direction of the component side and is redirected within the cooling structure
Implementation Method 2
creating turbulence, and maintaining uniform temperature across the cooling side
Implementation Method 3
It turned out to be particularly effective to use a heat exchange with a cooling liquid flowing passing the cooling structure to remove heat
Implementation Method 4
use a heat exchange with a cooling liquid flowing passing the cooling structure to remove heat
Data Source
AI summary
A system for cooling a metal-ceramic substrate (1) having a component side (5) and a cooling side (6) opposite the component side (5), comprisinga metallic cooling structure (20) with an integrated fluid channel (30) for guiding fluid within the cooling structure (20), anda distribution structure (40) made of plastic for supplying the fluid channel (30) with the fluid,wherein the cooling structure (20) has on its outer side (A) facing the distribution structure (40) an inlet opening (31) and an outlet opening (32) separate from the inlet opening (31), wherein the inlet opening (31) and the outlet opening (32) are connected to each other via the fluid channel (30) and the fluid channel (30) is configured such that, when the cooling structure is installed, the fluid is guided from the inlet opening (31) in the direction of the component side (5) and is redirected within the cooling structure (20).