Metal-Ceramic Substrate Layout for Bending and Heat Dissipation
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Solution Overview
Problem
Metal-ceramic substrates face issues with thermomechanical stresses due to differing thermal expansion coefficients, leading to bending and potential damage, and existing cooling structures are inadequate in heat dissipation and symmetry design.
Innovation Solution
The substrate features congruent primary structuring on both component and cooling metallization sides, with recesses extending parallel to the main extension plane, and a cooling part metallization connected directly to the insulation layer via DCB or AMB processes, enhancing symmetry and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a thin backside metallization is provided to counteract bending, then symmetry with regard to thermal expansion coefficients is improved, but thermal capacity is insufficient
Solution Approach 1:
The backside metallization is segmented into a first metallization layer and a second metallization layer with different functions. The first layer provides symmetry for counteracting bending, while the second layer provides additional thermal capacity. This segmentation allows each layer to be optimized for its specific function rather than requiring a single layer to fulfill both requirements.
Solution Approach 2:
The second metallization layer serves multiple functions: it provides thermal capacity for heat dissipation, acts as a buffer in overload situations, and maintains the overall symmetry of the substrate. By making this layer multi-functional, the design achieves both bending counteraction and sufficient thermal capacity without requiring excessive thickness.
2Quantity of substance
If the backside metallization is structured to increase thermal capacity, then thermal management is improved, but heat flow paths are disrupted
Solution Approach 1:
The second metallization layer is selectively structured only in regions where additional thermal capacity is needed, while maintaining continuous heat flow paths in critical areas. The structuring is localized to specific zones rather than applied uniformly, allowing optimization of thermal capacity without disrupting essential heat flow paths.
3Temperature
If cooling structures are added to the backside metallization, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The cooling structures are merged with the second metallization layer, combining the thermal management function with the existing structural layer. This integration eliminates the need for separate cooling components and reduces overall device complexity while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively counteracts bending and improves heat dissipation efficiency by increasing symmetry and allowing closer proximity of cooling fluids to the insulation layer, thereby enhancing the overall performance of the carrier substrate.
Implementation Method 1
the cooling part metallization connected directly to the insulation layer via DCB or AMB processes, enhancing symmetry and heat dissipation
Implementation Method 2
the different material choices for the insulation layer on the one hand and the metallization on the other hand pose the problem of different thermal expansion coefficients. These differing thermal expansion coefficients, when heat is generated, for example, during operation or during the manufacture of the carrier substrate, induce or cause thermomechanical stresses that can lead to bending
Data Source
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AI summary
The invention relates to a carrier substrate (1) for electrical components, in particular a metal-ceramic substrate for electrical components, comprising: an insulation layer (10), wherein the insulation layer (10) preferably has a material containing a ceramic or a composite containing at least one ceramic layer; a component metallisation (20) formed on a component side (BS) and having a first primary structure (21); and a cooling part metallisation (30) formed on a cooling side (KS) opposite the component side (BS) and having a second primary structure (31); wherein the insulation layer (10), the component metallisation (20) and the cooling part metallisation (30) are arranged on top of one another along a stacking direction (S), and wherein at least sections of the first primary structure (21) and the second primary structure (31) are congruent when viewed in the stacking direction (S).