Metal-Ceramic Substrate Structuring Without Etch Masking

The patent extracts and removes the masking step from the traditional etching process. By using laser structuring instead of chemical etching with masking, the method eliminates the need for applying, patterning, and removing masking layers, thereby significantly reducing production time and material consumption while maintaining structuring precision.

The patent replaces the chemical etching process with a mechanical/physical laser structuring process. The laser directly ablates or melts the metal layer to create the desired structures, substituting the chemical reaction-based etching process with a controlled energy input method that achieves the same structuring goal without requiring masking materials.

The patent extracts and eliminates the masking material from the process flow. By using laser structuring, there is no need for masking layers that must be applied and subsequently removed, thereby eliminating the material consumption associated with masking materials and reducing chemical agent usage.

The laser process uses a concentrated energy beam that can be precisely controlled and moved, replacing the need for disposable masking materials. The laser energy is applied only where needed, creating structures through localized material removal without requiring extensive masking coverage or large quantities of etching agents.

The patent applies laser processing with carefully controlled parameters (pulse duration, power density, scanning speed) to achieve structuring at temperatures that minimize thermal expansion differences between ceramic and metal. By using short-pulse laser technology, the heat-affected zone is reduced, allowing sufficient bonding strength while limiting thermomechanical stress accumulation.

The laser processing uses pulsed or periodic energy delivery rather than continuous heating. This periodic action allows brief intervals for heat dissipation and stress relaxation between pulses, enabling the accumulation of bonding strength over multiple cycles while preventing excessive temperature buildup that would cause differential thermal expansion damage.