Metal-Ceramic Substrate Support Thermal Expansion Management
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Solution Overview
Problem
Substrate supports in semiconductor manufacturing face issues due to material property mismatches between components, leading to damage and failure during repeated heating and cooling cycles, as components expand and contract at different rates.
Innovation Solution
The substrate support design incorporates metal-ceramic interfaces with gaps and metal foam structures that allow for expansion without damaging the ceramic surfaces, using protrusions and recesses, and brazing materials to secure components while accommodating thermal expansion differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If substrate support components are heated to high processing temperatures, then substrate processing capability is improved, but material property mismatches cause components to expand and push against each other causing damage
Solution Approach 1:
The patent applies thermal expansion principles by designing the metal-ceramic interface with a protrusion-recess configuration where the protrusion has a first portion in contact with the ceramic body and a second portion separated by a gap. This allows the metal component to expand into the gap during heating cycles without causing damage to the ceramic body, directly addressing the thermal expansion mismatch problem between dissimilar materials at high processing temperatures.
Solution Approach 2:
The patent implements beforehand cushioning by creating a gap between the second portion of the protrusion and the ceramic body before thermal cycling begins. This pre-established gap acts as a cushion that absorbs expansion forces during subsequent heating cycles, preventing damage to the ceramic body and maintaining component integrity throughout the thermal processing operations.
2Productivity
If substrate support components are cooled between processing cycles, then substrate support is available for next operation, but components contract and pull away from adjacent components causing damage at interfaces
Solution Approach 1:
The protrusion-recess design with a controlled gap accommodates both thermal expansion during heating and thermal contraction during cooling. The gap allows the metal component to contract away from the ceramic body during cooling cycles without creating damaging tensile stresses at the interface, enabling repeated thermal cycling while maintaining interface integrity and operational availability.
Solution Approach 2:
The pre-established gap serves as a cushion that absorbs both expansion forces during heating and contraction forces during cooling. This beforehand cushioning protects the metal-ceramic interface from damage during both phases of thermal cycling, ensuring reliable operation across multiple processing cycles.
3Strength
If metal and ceramic components are rigidly connected, then structural strength is improved, but differential thermal expansion causes damage to ceramic surfaces
Solution Approach 1:
The patent applies local quality by creating a non-uniform connection between the metal protrusion and ceramic body. The first portion of the protrusion is in direct contact with the ceramic body for structural strength, while the second portion is separated by a gap to allow thermal expansion. This localized differentiation in connection quality enables both structural integrity and thermal expansion accommodation without damaging the ceramic surfaces.
Solution Approach 2:
The protrusion is segmented into two distinct portions: a first portion that contacts the ceramic body to provide structural strength, and a second portion that is separated by a gap to accommodate thermal expansion. This segmentation allows the single protrusion feature to simultaneously fulfill both structural and thermal accommodation functions, preventing ceramic surface damage while maintaining overall structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces damage and failure of electrical connections by allowing relative movement and absorbing expansion forces, maintaining structural integrity at high temperatures up to 650°C.
Implementation Method 1
mismatch of material properties between different components of the substrate support may cause one or more components of the substrate support to expand and push against other components when the substrate support is heated
Implementation Method 2
A first portion of a brazing material is disposed in between a base of the aperture and an end of the rod member
Data Source
AI summary
Embodiments of the present disclosure generally relate to substrate support assemblies used in semiconductor device manufacturing. In one embodiment, a substrate support includes a ceramic body having at least one aperture formed therein defined by a sidewall. A plurality of recesses extend into the sidewall, a rod member is disposed in the at least one aperture, and an eyelet member is circumferentially disposed about the rod member. The eyelet member has a plurality of protrusions extending outwardly therefrom, each disposed in a corresponding recess of the plurality of recesses. A first portion of each protrusion is in contact with a sidewall of the respective recess of the ceramic body and a second portion of each protrusion is separated by a gap from the sidewall of the respective recess of the ceramic body. A first portion of a brazing material is disposed between an upper surface of the at least one aperture and an end of the rod member.