Metal Chalcogenide Precursor Solution via Sodium Ion Mediation

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Solution Overview

Problem

The existing metal chalcogenide film deposition techniques face challenges in dissolving inorganic compounds in solvents due to their poor solubility, leading to the formation of porous films with carbon residues that affect electrical properties, and the use of hydrazine-based solvents is limited by explosiveness and toxicity.

Innovation Solution

A precursor solution using non-explosive hydrazine-based solvents, such as hydrazine hydrates, derivatives, or hydrates, with added sodium ions to facilitate the dissolution of metal chalcogenide compounds through dimension reduction mechanisms, allowing for the formation of dense metal chalcogenide films without the risks associated with hydrazine.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If organometallic compounds are used as precursors to form inorganic films, then the precursor solution can be prepared with good solubility, but organic moieties remain in the film causing porosity and carbon residues that adversely affect electrical properties

Engineering Contradiction:
Improvesolubility of precursorVSAvoidcarbon residue and porosity
Core Design Contradiction:
Quantity of substanceVSObject-generated harmful factors

Solution Approach 1:

The invention extracts and removes the organic moiety from the precursor compound, using only inorganic metal salts (such as zinc acetate) as precursors. This eliminates the source of carbon residues and porosity while maintaining the ability to form complete inorganic films through the liquid deposition process.

Inventive Principle:
Principle #2Taking out (Extraction)

2Quantity of substance

If hydrazine is used as a solvent to dissolve metal chalcogenide compounds through dimension reduction mechanism, then the compounds can be dissolved effectively, but the solvent is poisonous and explosive creating safety issues

Engineering Contradiction:
Improvedissolution capabilityVSAvoidtoxicity and explosiveness
Core Design Contradiction:
Quantity of substanceVSObject-affected harmful factors

Solution Approach 1:

The invention introduces an intermediary substance (sodium) that enables the dissolution of metal chalcogenide compounds in safe solvents. Sodium acts as a mediator that facilitates the dimension reduction mechanism without requiring the use of explosive hydrazine, thereby achieving both dissolution capability and safety.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention replaces the dangerous hydrazine solvent with safer, more readily available alternatives such as water or alcohol-based solvents. These substitutes are less hazardous and can be easily disposed of, eliminating the safety risks associated with hydrazine while maintaining the dissolution function.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Manufacturing precision

If vapor deposition processes are used to form metal chalcogenide films, then film deposition can be achieved, but equipment costs, facility requirements, and energy consumption are significantly high

Engineering Contradiction:
Improvefilm deposition qualityVSAvoidequipment and facility complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The invention replaces the complex mechanical vapor deposition systems with a simple liquid deposition process. By dissolving metal chalcogenide compounds in liquid precursors and applying them through spin coating or dip coating, the need for expensive vacuum chambers, heating systems, and complex equipment is eliminated while still achieving high-quality film deposition.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables the safe and cost-effective production of metal chalcogenide films with improved electrical properties by dissolving metal chalcogenide compounds in non-explosive solvents, reducing toxicity and explosiveness, and allowing for annealing in ambient conditions, suitable for industrial applications.

Implementation Method 1

Te2+ ions in hydrazine attack and break a bond between zinc (Zn) and Te. Accordingly, the ZnTe bulk particles are divided and converted into a solute having a size of monomer (Zn—Te) or cluster including two to several hundreds of '—Zn—Te—' units.

Methodology Applied
Scientific EffectDimension reduction mechanism:

Implementation Method 2

If a precursor solution using non-explosive hydrazine-based solvents, such as hydrazine hydrates, derivatives, or hydrates, with added sodium ions to facilitate the dissolution of metal chalcogenide compounds through dimension reduction mechanisms

Methodology Applied
Scientific EffectIonization: Ionisation

Implementation Method 3

removing the non-explosive hydrazine-based solvent from the precursor solution layer to form a precursor film layer

Methodology Applied
Scientific EffectEvaporation: Evaporation

Implementation Method 4

annealing the precursor film layer to form a metal chalcogenide film

Methodology Applied
Scientific EffectAnnealing: Annealing

Data Source

PatentUS9879143B2Precursor solution for forming metal chalcogenide film
Publication Date: 2018.01.30 SAMSUNG ELECTRONICS CO LTD
  • US9879143B2 patent drawing
  • US9879143B2 patent drawing
  • US9879143B2 patent drawing

AI summary

A chalcogen element can be effectively dissolved in a non-explosive hydrazine-based solvent by the aid of sodium in a non-explosive hydrazine-based solvent. Therefore, a precursor solution for forming a metal chalcogenide film containing as a solvent a non-explosive hydrazine-based solvent which is less poisonous than hydrazine and which is free of explosiveness is provided. A metal chacogenide thin film may be formed employing the metal chalcogenide precursor solution.