Metal Channel Layer Direct Liquid Cooling for Integrated Circuits
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Solution Overview
Problem
Traditional thermal management approaches for silicon chips with advanced integrated circuits are limited in cooling capability due to reliance on interface contact for heat dissipation, necessitating more effective heat dissipation methods.
Innovation Solution
A device and method for direct liquid cooling using a metal channel layer with channels on top of a packaged assembly, incorporating a pump for fluid circulation, and a top seal with inlets and outlets for efficient heat dissipation, which includes a stiffener member and epoxy for structural support and planarization, utilizing materials like copper or silver for enhanced thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional high thermal conductive materials are used for heat dissipation, then the interface contact method provides basic cooling, but the cooling capability is limited and heat dissipation speed is insufficient
Solution Approach 1:
The patent applies liquid cooling by circulating coolant through channels formed in the substrate to directly remove heat from the integrated circuit. The fluid flow through the channel structures enables efficient heat transport away from the heat-generating components, resolving the limitation of traditional solid-to-solid thermal contact methods.
Solution Approach 2:
The patent utilizes the substrate itself as a channel structure with formed pathways that allow coolant flow. The substrate is configured with internal channels that provide direct thermal contact between the coolant and the integrated circuit, enabling the substrate to function as both structural support and thermal management component.
2Productivity
If liquid cooling techniques are implemented, then heat dissipation speed is promoted, but the device structure becomes more complex
Solution Approach 1:
The patent merges the substrate's structural function with thermal management by forming cooling channels directly within the substrate material. This integration eliminates the need for separate cooling components and reduces overall device complexity while maintaining high heat dissipation performance.
Solution Approach 2:
The substrate serves multiple functions: providing mechanical support for the integrated circuit, establishing electrical connections, and acting as a thermal management system through its internal coolant channels. This multi-functionality reduces the number of discrete components needed in the device.
3Temperature
If channels are formed in the substrate for coolant flow, then direct liquid cooling is achieved, but the manufacturing process becomes more difficult
Solution Approach 1:
The cooling channels are formed in the substrate during the substrate fabrication process itself, before the integrated circuit is mounted. This preliminary formation of channels using standard semiconductor manufacturing techniques (such as etching and deposition) integrates thermal management into the base manufacturing flow without requiring additional complex post-processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced heat dissipation by combining direct physical contact with a cooling liquid, effectively reducing the temperature of the packaged assembly by a significant margin, while being compatible with existing manufacturing processes and equipment.
Implementation Method 1
direct physical contact with a cooling liquid, effectively reducing the temperature of the packaged assembly
Implementation Method 2
incorporating a pump for fluid circulation
Implementation Method 3
utilizing materials like copper or silver for enhanced thermal conductivity
Data Source
Figure 1A
Figure 1B
Figure 1C
AI summary
A device for direct liquid cooling is disclosed. The device includes a packaged assembly disposed on a substrate. The device also includes a metal channel layer having a plurality of channels disposed on top of the packaged assembly, and a top seal disposed on the metal channel layer. The top seal has at least one inlet and at least one outlet for direct liquid cooling. The metal channel layer includes copper or silver. The packaged assembly can also include silicon channels. In addition, the method of producing the device is also disclosed.