Metal Chip Card Element with Ferrite Flux-Diversion Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Chip cards with metallic surfaces require a slit for magnetic flux diversion, which compromises structural integrity and necessitate additional internal coils for inductive coupling, leading to complex and costly construction.
Innovation Solution
A card body design with an outer metal layer interrupted only by a module opening, featuring a ferrite layer and internal slit, allowing for a planar and stable metallic surface, enhanced by a plastics layer for mechanical stability and energy efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a slit is formed in the outer metal layer for magnetic flux diversion, then electromagnetic performance is improved, but structural integrity and aesthetic quality deteriorate
Solution Approach 1:
The patent moves the slit from the outer metal layer to the inner metal layer, changing the spatial dimension where the slit is located. This allows the outer layer to maintain its continuous, intact structure for structural integrity and aesthetics, while the inner layer provides the necessary magnetic flux diversion path for electromagnetic performance.
Solution Approach 2:
The patent divides the card body into multiple layers (outer metal layer, ferrite layer, inner metal layer, plastic layer), separating the functions of structural integrity (outer layer) and electromagnetic performance (inner layer with slit). This segmentation allows each layer to optimize for its specific function without compromising the other.
2Reliability
If an additional internal coil is added for inductive coupling in cards without outer slits, then contactless communication functionality is maintained, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent extracts the magnetic flux diversion function from the outer metal layer and places it in the inner metal layer. This eliminates the need for additional internal coils, as the slit in the inner layer combined with the ferrite layer provides sufficient magnetic flux management for contactless communication without increasing device complexity.
3Ease of manufacture
If the module opening extends through the entire card body, then chip module installation is simplified, but mechanical stability and energy efficiency deteriorate
Solution Approach 1:
The patent modifies the module opening geometry by creating a reduced cross-section portion in the inner metal layer, effectively making the opening path non-uniform through the layers. This allows the opening to extend through the card body for easy module installation while the reduced cross-section in the inner layer maintains mechanical stability and optimizes energy efficiency by controlling field distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design provides a mechanically stable, high-quality chip card with improved energy input and simplified manufacturing, while maintaining electromagnetic performance and enabling security and decorative features.
Implementation Method 1
The attenuations of the outer metallic layer that are negative for HF fields can be eliminated by means of the ferrite layer
Implementation Method 2
The energy coupling of DI systems with a two coil system (SPS) takes place by means of metal superstructures having a slit, in which the magnetic flux/current flow in the metal surfaces is diverted
Implementation Method 3
chip card controllers with RFID functionality can be used
Data Source
AI summary
A card element for a chip card, includes an outer metal layer with a flat surface interrupted only by a module opening for receiving a chip module. The module opening extends to an inner side and includes a ferrite layer located on the inner side and through which the opening extends. An inner metal layer is disposed on the ferrite layer through which a portion of the module opening has a reduced cross-section extends. A slit extends from a peripheral surface of the inner metal layer to the module opening and extends through the entire thickness of the inner metal layer. A final layer is made of plastic and disposed on the inner metal layer.