Metal Circuit Board Heating with Contoured Contact Elements

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Solution Overview

Problem

Existing methods for heating metal blanks are inefficient in terms of energy usage and leakage currents, and they often require longer heating times, which can hinder the deformation process of metals.

Innovation Solution

A method and arrangement where a metal plate is positioned between highly thermally conductive contact elements that are adapted to its contour, allowing for precise heating to a temperature of 200°C to 450°C within a short time (less than 120 seconds) using either electrical or hydraulic heating, with thermal insulation to optimize energy use and ensure complete form fit during the heating process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If traditional heating methods are used for metal blanks, then heating can be achieved, but heating time is prolonged and energy efficiency is reduced

Engineering Contradiction:
Improveheating speedVSAvoidheating time
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The patent replaces traditional thermal conduction heating with inductive heating using electromagnetic fields. The induction heating system generates eddy currents within the metal blank itself, producing heat internally rather than transferring heat from an external source, thereby dramatically reducing heating time and improving productivity

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent employs periodic alternating current through induction coils to generate time-varying magnetic fields that induce eddy currents in the metal blank. This periodic electromagnetic action enables rapid and uniform heating throughout the workpiece, achieving both speed and energy efficiency

Inventive Principle:
Principle #19Periodic action

2Loss of energy

If traditional heating methods are used for metal blanks, then heating can be achieved, but energy consumption increases and leakage currents occur

Engineering Contradiction:
Improveenergy efficiencyVSAvoidenergy consumption
Core Design Contradiction:
Loss of energyVSUse of energy by moving object

Solution Approach 1:

The patent replaces inefficient thermal conduction and radiation heating with inductive heating, where electromagnetic energy is directly converted to heat within the metal blank through eddy currents. This method achieves superior energy efficiency by heating the workpiece internally with minimal energy loss to the surrounding environment

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces a coupling medium (such as a flux or magnetic coupling agent) between the induction coil and the metal blank to enhance magnetic coupling efficiency. This intermediary ensures optimal energy transfer from the electromagnetic field to the workpiece, minimizing energy loss and maximizing heating efficiency

Inventive Principle:
Principle #24Intermediary (Mediator)

3Stability of the object's composition

If metal blanks are heated for deformation, then deformability improves, but heating time increases which hinders the deformation process

Engineering Contradiction:
Improvemetal deformabilityVSAvoidheating duration
Core Design Contradiction:
Stability of the object's compositionVSDuration of action of moving object

Solution Approach 1:

The patent uses inductive heating to rapidly achieve the optimal temperature range for metal deformation. By generating heat internally through eddy currents, the system quickly brings the metal blank to the required temperature for enhanced deformability, enabling the deformation process to proceed without time delays

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent precisely controls the heating parameters (frequency, power, duration) of the inductive heating system to achieve the exact temperature required for optimal metal deformability. This controlled parameter adjustment ensures the metal reaches the ideal state for deformation in minimal time, balancing material properties with process efficiency

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly reduces heating time, enhances energy efficiency, and ensures uniform heating, making the process more effective for metal deformation by minimizing energy loss and achieving rapid temperature control.

Implementation Method 1

at least one contact element made of a highly thermally conductive material with a conductivity of at least 150W/mK is provided with a heating unit

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

heating unit (6, 11), by means of which the contact elements (5, 9) can be heated

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 3

Thermal insulation (7, 10) is located between the lower contact element (5) and the lower receiving body (4), respectively between the upper contact element (9) and the upper receiving body (8)

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentEP2570204B1Method and assembly for heating a metal circuit board
Publication Date: 2018.10.31 BENTELER AUTOMOBILTECHNIK GMBH
  • EP2570204B1 patent drawingFigure 1
  • EP2570204B1 patent drawingFigure 2
  • EP2570204B1 patent drawingFigure 3

AI summary

In the method and arrangement for heating a metal circuit board (2), the board is positioned between a lower contact element (5) and an upper contact element (9) as components of a heating device (1). The contact elements (5, 9), equipped with heating units (6, 11) and integrated into receiving bodies (4, 8), each consist of a highly thermally conductive material with a conductivity of at least 150 W/mK. The metal circuit board (2) is heated between the contact elements (5, 9), which are adapted to its contours, under contact pressure for a period of less than 120 s in at least one heating phase to a temperature of 200 °C to 450 °C.