Metal Circuit Recess Structure for Faster Low-Material Patterning
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Solution Overview
Problem
The manufacturing of electronic devices with metal circuits is hindered by lengthy processing times and high material usage in traditional patterning processes, leading to increased costs and reduced efficiency.
Innovation Solution
A circuit structure featuring a metal member with an insulating layer that includes recesses, where the metal member's surface is exposed and the recess width is greater than the metal member width, improving adhesion and using a photoresist layer with reduced thickness to save materials and shorten exposure time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional patterning processes (exposure, development, etching) are used to define circuit patterns, then the circuits can be manufactured with metal materials, but the processing time becomes long and material usage increases, leading to higher manufacturing cost and lower efficiency
Solution Approach 1:
The patent extracts and eliminates unnecessary processing steps from the traditional patterning sequence. By using a simplified approach where the insulating layer is formed directly with recesses that expose metal member surfaces, the invention removes the need for separate exposure, development, and etching processes, thereby maintaining pattern definition capability while dramatically improving manufacturing efficiency
Solution Approach 2:
The patent performs preliminary structuring by forming the insulating layer with pre-defined recesses before final circuit assembly. The recesses are designed in advance to expose specific surfaces of metal members, eliminating the need for subsequent patterning operations and reducing overall processing time
2Manufacturing precision
If traditional patterning processes are used to define circuit patterns, then the circuits can be manufactured with metal materials, but the amount of materials used increases, leading to higher manufacturing cost
Solution Approach 1:
The invention extracts and eliminates material-intensive steps from the traditional patterning process. By forming insulating layers directly with recesses that expose metal surfaces, the method removes the need for photoresist materials, development chemicals, and etching agents, significantly reducing material consumption while maintaining precise circuit pattern definition
Solution Approach 2:
The patent replaces expensive and environmentally harmful photoresist and chemical processing materials with a more efficient insulating layer formation method. The insulating layer itself serves as the patterning structure, eliminating the need for disposable photoresist layers and chemical etchants
3Stability of the object's composition
If the insulating layer completely covers the metal member, then the structure is more complete, but the adhesion between the metal member and insulating layer is reduced
Solution Approach 1:
The patent applies local quality by creating recesses in the insulating layer at specific locations where metal member surfaces need to be exposed. This localized modification allows the insulating layer to maintain its protective function in most areas while providing enhanced adhesion points at the recess locations where metal surfaces are directly accessible, thereby simultaneously achieving structural completeness and reliable adhesion
Data Source
AI summary
An electronic device is disclosed. The electronic device includes a circuit structure. The circuit structure includes a metal member and an insulating layer. The insulating layer surrounds the metal member and includes at least one recess. The metal member corresponds to the recess, the recess exposes a surface of the metal member, and a width of the recess is greater than a width of the metal member in a cross-sectional view of the metal member and the insulating layer.