Metal Circuit Structure with Trigger Layer for LDS
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Solution Overview
Problem
Current laser direct structuring (LDS) technology is limited to specific plastic substrates and is not suitable for high-frequency antennas due to its applicability constraints and inability to form multi-layer conductive circuits with sufficient precision and thickness.
Innovation Solution
A method involving a curable liquid trigger material with insulating gel and trigger particles, activated by laser, is used to form a metal circuit structure on various substrates through electroless plating, allowing for single or multi-layer metal circuits with improved dielectric properties and reduced thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If laser direct structuring (LDS) technology is used to form conductive circuits, then the conductive material can be directly electroplated on device casing, but the technology is limited to certain plastic substrates with limited dielectric constants and cannot form multi-layer conductive circuits
Solution Approach 1:
The patent introduces a trigger layer as an intermediary material between the substrate and the electroless plating solution. This trigger layer contains trigger particles that can be selectively activated by laser to initiate metal deposition. The trigger layer enables the process to work on various substrate types (not just plastic) and allows for multi-layer circuit formation by controlling the trigger particle activation pattern, thus resolving the limitations of conventional LDS technology.
Solution Approach 2:
The patent changes the dielectric constant parameter of the trigger layer material to fall within the range of 2-6.5, which is suitable for high-frequency applications. By controlling the composition and properties of the trigger layer (including the dielectric constant of the gel and the properties of trigger particles), the technology can be adapted to different substrate types and circuit layer requirements, enabling both single-layer and multi-layer conductive circuit formation.
2Manufacturing precision
If laser direct structuring (LDS) technology is used, then the overall structure can be formed, but the thickness of laser-etched conductive circuit needs at least 10-15 μm and only a single-layer conductive circuit can be formed
Solution Approach 1:
The patent segments the conductive circuit formation into multiple independent layers, each formed by separate trigger layer application and laser activation. This segmentation allows each layer to be optimized independently for thickness and material composition, enabling the formation of multiple conductive circuit layers (single-layer or multi-layer) with precise thickness control, overcoming the limitation of conventional LDS that can only form single-layer circuits with minimum 10-15 μm thickness.
3Reliability
If conventional LDS technology is used for high-frequency antennas, then the structure can be formed, but the dielectric constant is not suitable for high-frequency applications
Solution Approach 1:
The patent specifically controls the dielectric constant parameter of the trigger layer to be within the range of 2-6.5, which is optimized for high-frequency applications. By selecting appropriate gel materials and trigger particle compositions, the technology achieves the required dielectric properties for high-frequency antennas while maintaining versatility across different substrate types, thus resolving the contradiction between reliability for high-frequency performance and adaptability to different applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of metal circuits with higher dielectric constants, narrower line widths, and multi-layer capabilities, suitable for high-frequency applications, overcoming the limitations of conventional LDS technology.
Implementation Method 1
an insulating gel comprised of a curable macromolecular material
Implementation Method 2
ablating the first trigger layer using a laser having a first wavelength to form a first circuit pattern
Implementation Method 3
depositing a metal material on the first circuit pattern by electroless plating to form a first metal circuit layer
Data Source
AI summary
A metal circuit structure is provided. The metal circuit structure includes a substrate, a first trigger layer and a first metal circuit layer. The first trigger layer is disposed on the substrate and includes a first metal circuit pattern. The first metal circuit layer is disposed on the first circuit pattern and is electrically insulated from the substrate. The composition of the first trigger layer includes an insulating gel and a plurality of trigger particles. The trigger particles are at least one of organometallic particles, a chelation and a semiconductor material having an energy gap greater than or equal to 3 eV. The trigger particles are disposed in the insulating gel, such that the dielectric constant of the first trigger layer after curing is between 2 and 6.5.