Metal-clad laminate with core-shell particles for adhesion

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Solution Overview

Problem

Existing metal-clad laminates using polyphenylene ether substrates face challenges in achieving sufficient adhesiveness between the substrate and metal foil, particularly when the metal foil has low surface roughness, which affects dielectric characteristics and stability.

Innovation Solution

Incorporating a resin composition with a dielectric dissipation factor of not more than 0.0100 at 10 GHz and core-shell polymer particles with a volume-average particle size of 10 nm to 400 nm, along with a fibrous base material and metal foil with a ten-point average roughness of not more than 2.0 μm, to enhance adhesiveness and dielectric properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If polyphenylene ether is used as substrate material to achieve low dielectric constant and low dielectric dissipation factor, then dielectric characteristics are improved, but adhesiveness between substrate and metal foil deteriorates

Engineering Contradiction:
Improvedielectric characteristicsVSAvoidadhesiveness between substrate and metal foil
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent uses a composite resin composition containing polyphenylene ether (PPE) as the base resin combined with specific rubber particles (nitrile rubber, butadiene rubber, or styrene-butadiene rubber) to create a multi-phase material system. This composite structure allows the PPE to provide low dielectric properties while the rubber particles provide adhesion promotion, resolving the contradiction between dielectric characteristics and adhesiveness.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent specifies precise parameter ranges for the rubber particle content (5-50 parts by weight per 100 parts by weight of PPE) and particle size (average diameter of 0.01-10 μm) to optimize both dielectric properties and adhesiveness. By controlling these parameters, the material achieves the desired balance between low dielectric dissipation factor and high peel strength.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If metal foil with low surface roughness is used to improve dielectric characteristics, then signal transmission is improved, but adhesiveness between substrate and metal foil deteriorates

Engineering Contradiction:
Improvedielectric characteristicsVSAvoidadhesiveness between substrate and metal foil
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The rubber-containing resin composition acts as an intermediary layer between the smooth metal foil surface and the PPE substrate. The rubber particles in the resin provide enhanced interfacial adhesion to the metal surface, allowing the use of low-roughness metal foil (Rz ≤ 2.0 μm) while maintaining strong peel strength (≥ 0.43 N/mm) through the adhesive properties of the rubber-modified resin.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS11889623B2Metal-clad laminate, printed circuit board, and method of manufacturing same
Publication Date: 2024.01.30 KANEKA CORP
  • US11889623B2 patent drawing
  • US11889623B2 patent drawing
  • US11889623B2 patent drawing

AI summary

A metal-clad laminate and techniques using the metal-clad laminate are provided where the metal-clad laminate has excellent adhesiveness between a substrate and metal foil in addition to good dielectric characteristics and heat resistance. The metal-clad laminate includes an insulating layer in contact with metal foil where the insulating layer further includes a resin composition and a fibrous base material. The resin composition contains a specific resin (A) and specific core-shell polymer particles (B), and a surface of the metal foil has a ten-point average roughness (Rz) of not more than 2.0 μm.