Metal-clad laminate electroless plating adhesion
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Solution Overview
Problem
The production of metal-clad laminates for circuit boards faces challenges in achieving fine wiring due to the susceptibility of transferred metal film layers to damage during processing steps, such as desmearing and electroplating, which affects the adhesion and integrity of the conductor layer.
Innovation Solution
A method involving the preparation of a metal-clad laminate precursor by sandwiching prepreg between metal film-coated films, removing the support layer, and forming a metal film layer on the insulating surface via electroless plating, ensuring superior peel strength and surface smoothness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a metal film layer is transferred onto an adhered by using a film with a metal film, then fine wiring is enabled, but the metal film layer becomes susceptible to damage during processing steps
Solution Approach 1:
The patent introduces a plating seed layer as an intermediary between the metal film layer and the insulating layer. This plating seed layer serves as a protective mediator that prevents direct contact between the metal film layer and damaging processing solutions (oxidizers, acidic solutions), thereby maintaining metal film integrity while still enabling fine wiring capability
Solution Approach 2:
The patent applies a plating seed layer to the insulating layer surface before transferring and forming the metal film layer. This preliminary action creates a protective barrier in advance, preventing damage during subsequent processing steps such as desmearing and through-hole formation
2Strength
If concave and convex are formed in the interface between conductor layer and prepreg layer, then adhesion is improved, but conductor layer removal becomes difficult and fine wiring is prevented
Solution Approach 1:
The patent creates local adhesion enhancement by forming protrusions only at specific locations (through-hole regions) rather than across the entire interface. This localized approach maintains strong adhesion where needed while preserving the smooth surface quality required for fine wiring in other areas
Solution Approach 2:
The patent uses a mold to copy and transfer a controlled pattern of protrusions onto the insulating layer surface. This copying process creates uniform, precisely-controlled adhesion features that do not compromise the overall smoothness needed for fine wiring
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the formation of a conductor layer with superior peel strength on a smooth insulating surface, enhancing the reliability and durability of circuit boards by minimizing damage to the metal film during processing.
Implementation Method 1
a step of forming a metal film layer on the surface of an insulating layer by electroless plating
Implementation Method 2
heating and pressing them under reduced pressure to achieve lamination and integration
Data Source
AI summary
Metal-clad laminates in which a conductor layer having superior peel strength is formed on a smooth surface of an insulating layer can be obtained by a method comprising (A) a step of preparing a metal-clad laminate precursor by providing one or more sheets of prepreg between two sheets of film having a metal film layer on a support layer, and heating and pressing them under reduced pressure, (B) a step of removing the support layer, (C) a step of removing the metal film layer, and (D) a step of forming a metal film layer on the surface of an insulating layer by electroless plating.