Metal Clip Bonding Structure for Power Module Chip Alignment
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Solution Overview
Problem
The existing methods for mounting power modules on inverter heat sinks suffer from misalignment and increased manufacturing defects due to soldering issues, leading to inefficiencies and higher defect rates, particularly in hybrid and electric vehicles.
Innovation Solution
A metal clip with bonding parts and outer side parts is used to secure chips, featuring pressing grooves and symmetrical outer side parts to maintain alignment, combined with preform solder and a soldering pressure jig for precise positioning and integrated soldering processes, reducing voids and simplifying assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a soldering method is used to mount the power module on the inverter heat sink, then the power module can be attached to the heat sink, but misalignment occurs during soldering causing manufacturing defects
Solution Approach 1:
The patent applies preliminary action by pre-forming pressing grooves on the bonding parts before the soldering process. These grooves are created through pressing or embossing to establish precise alignment features in advance, preventing misalignment during the subsequent soldering operation and eliminating the need for complex real-time alignment adjustments
Solution Approach 2:
The pressing grooves act as an intermediary alignment mechanism between the bonding parts and the chips. These grooves provide physical guides that mediate the positioning relationship, ensuring accurate alignment without requiring complex soldering process control or advanced alignment equipment
2Ease of manufacture
If the power module is mounted on a flat surface of the inverter heat sink, then the mounting process is simple, but misalignment and voids occur during soldering reducing thermal performance
Solution Approach 1:
The patent applies local quality by modifying only specific localized regions of the bonding parts - the pressing grooves are formed locally at predetermined positions on the bonding surfaces. This localized modification maintains the overall simplicity of the flat mounting surface while introducing precise alignment features only where needed, avoiding complex global restructuring
Solution Approach 2:
The pressing grooves are pre-formed on the bonding parts before assembly, establishing alignment guides in advance. This preliminary action ensures that during the simple flat-surface mounting process, the components self-align correctly, preventing misalignment and void formation without complicating the overall mounting procedure
3Reliability
If multiple soldering processes are used to manufacture the power module, then comprehensive bonding is achieved, but the defective rate increases and manufacturing complexity increases
Solution Approach 1:
The patent merges multiple soldering processes into a single integrated bonding operation. The pressing grooves on the bonding parts enable all bonding operations to be performed simultaneously in one step, combining what would otherwise require sequential primary and secondary soldering processes. This reduces process complexity while maintaining bonding completeness through the self-aligning groove features
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances thermal performance, structural stability, and manufacturing yield by preventing misalignment and reducing the number of soldering processes, thereby improving the reliability and efficiency of power modules in vehicles.
Implementation Method 1
a plurality of bonding parts each having a lower surface configured to bond to an upper surface of each of the chips
Data Source
AI summary
A metal clip disposed on chips to connect the chips to each other, includes a plurality of bonding parts each having a lower surface configured to bond to an upper surface of each of the chips; and an outer side part formed at each of the bonding parts to extend upward from at least a portion of an outer side of respective ones of the bonding parts to form a step therefrom.