Metal Clip Assembly With Spatial Positioning for Accurate Chip Packaging
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Solution Overview
Problem
Current electrical connection technologies using copper clips in semiconductor devices face issues with uneven bonding line thickness distribution, tilting, poor assembly consistency, and low density of semiconductor chip units, affecting reliability and package dimension accuracy.
Innovation Solution
A metal clip assembly with spatial positioning grooves and connectors, including X-direction and Y-direction positioning pins, ensures accurate placement and integration of copper clips with semiconductor chips, enhancing assembly accuracy and density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If copper clips are used to replace metal wires for electrical connection, then heat dissipation capability and current carrying capability are improved, but assembly consistency and reliability deteriorate due to uneven bonding line thickness and tilting
Solution Approach 1:
The patent introduces spatial positioning grooves on the copper frame and corresponding positioning protrusions on the copper clips before the bonding process. These positioning features are pre-designed to guide the copper clips into correct positions, ensuring uniform bonding line thickness and preventing tilting during assembly. This preliminary structural design resolves the assembly consistency issue while maintaining the superior electrical and thermal performance of copper clips.
2Power
If copper clips are used to replace metal wires for electrical connection, then current carrying capability is improved, but manufacturing precision deteriorates due to poor assembly accuracy
Solution Approach 1:
The patent introduces spatial positioning grooves as intermediary structures on the copper frame and matching positioning protrusions on the copper clips. These intermediary positioning features act as mediators that guide and constrain the relative positions of the copper clips and semiconductor chips during assembly. This ensures high assembly accuracy and manufacturing precision while maintaining the high current carrying capability of copper clips.
3Productivity
If multiple semiconductor chip units are disposed on the same copper frame, then productivity is improved, but device complexity increases due to positioning and isolation requirements
Solution Approach 1:
The patent designs the spatial positioning grooves to serve multiple functions simultaneously: they position multiple copper clips accurately, provide isolation between adjacent chip units, and maintain structural integrity of the copper frame. This multi-functional design enables high-density integration of multiple semiconductor chip units on a single copper frame without significantly increasing device complexity, thereby improving productivity.
Data Source
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AI summary
A metal clip assembly, a semiconductor device assembly, a preparation method therefor, and a use therefor are provided. The metal clip assembly includes metal clip units. The metal clip units include connectors, pins, and at least one group of spatial positioning grooves. By sharing the at least one group of spatial positioning grooves, a spatial structure of the metal clip assembly is simplified, and it facilitates convenient positioning on the metal frame. Positions of the metal clip assemblies are positioned in a horizontal direction through cooperation between X-direction positioning grooves and X-direction positioning pins, and cooperation between Y-direction positioning grooves and Y-direction positioning pins. Further, positions of the metal clip assemblies in a height direction is positioned by configuration of positioning bumps. Through a surface tension of melt solder paste, an automatic alignment of the metal clip assemblies is completed on the metal frame.