Transition Metal Cluster Resist for Stable Fine Patterning
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Solution Overview
Problem
Metal-containing resists used in semiconductor photolithography are prone to react with oxygen or moisture, affecting storage stability and developability, which limits their application in ultra-fine pattern formation.
Innovation Solution
A transition metal cluster compound with specific carboxy ligands, including an alicyclic structure with a double bond, is developed to enhance storage stability and developability, comprising 2 to 20 transition metal atoms and two or more types of carboxy ligands, which react to form insoluble patterns upon electron beam or extreme ultraviolet light exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If metal-containing resists are used to form ultra-fine patterns without acid diffusion, then line edge roughness is improved and resolution is enhanced, but storage stability deteriorates due to easy reaction with oxygen or moisture
Solution Approach 1:
The patent introduces an organic polymer component as an intermediary substance that protects the metal-containing resist from direct contact with oxygen and moisture during storage. The polymer matrix encapsulates the metal particles, acting as a barrier that prevents harmful reactions while allowing the metal component to function as intended during the lithography process.
Solution Approach 2:
The patent creates an inert environment by formulating the metal-containing resist within an organic polymer matrix that provides chemical inertness. This matrix isolates the reactive metal components from atmospheric oxygen and moisture, effectively creating a protected microenvironment that maintains storage stability without compromising the photosensitive functionality.
2Reliability
If metal-containing resists are used as photosensitive substances, then acid diffusion is eliminated and sensitivity is improved, but developability deteriorates due to reaction with oxygen or moisture
Solution Approach 1:
The organic polymer serves as a mediator that enables the metal-containing resist to maintain its high sensitivity by preventing premature reactions with oxygen and moisture during storage and handling, while still allowing the metal component to function as the active photosensitive substance during exposure and development processes.
Solution Approach 2:
The patent applies preliminary protective action by pre-encapsulating the metal-containing resist in an organic polymer matrix before exposure to atmospheric conditions. This preliminary protection prevents degradation during storage and handling, ensuring that the material remains ready for use without compromising its photosensitive properties or developability.
3Productivity
If chemically amplified resists with photoacid generators are used, then high resolution and low roughness are achieved through chemical reactions, but line edge roughness increases due to acid diffusion
Solution Approach 1:
The patent extracts and eliminates the acid diffusion mechanism from the lithography process by replacing the photoacid generator system with a direct metal-based photosensitive system. By removing the chemical amplification step that causes acid diffusion, the invention achieves sharp pattern edges without the associated line edge roughness while maintaining high resolution through the metal component's direct photosensitivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The transition metal cluster compound exhibits excellent storage stability and developability, allowing for the formation of fine patterns without line edge roughness, suitable for ultra-fine semiconductor manufacturing.
Implementation Method 1
react to form insoluble patterns upon electron beam or extreme ultraviolet light exposure
Data Source
AI summary
An object of the present invention is to provide a transition metal cluster compound by which miniaturization of a circuit pattern can be realized; a photosensitive composition containing the transition metal cluster compound; and a pattern forming method using the photosensitive composition. The transition metal cluster compound is characterized by including 2 or more and 20 or less transition metal atoms and two or more types of carboxy ligands, wherein at least one type of the carboxy ligands includes an alicyclic structure having a double bond.


