Metal-Coated Plasma-Treated Thermoplastic Interlayers
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Solution Overview
Problem
Thermoplastic layers in composite materials used in aircraft and machines are not conductive, leading to the retention of unwanted electric current and charge after electric charging, which can cause electrical build-up and interference.
Innovation Solution
A method involving the formation of interlayers from thermoplastic fibers, treated with atmospheric-pressure plasma to enhance surface activation, followed by the deposition of multiple metal layers to increase conductivity, which are then integrated between reinforcing layers within a composite material to improve electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If thermoplastic layers are used in composite materials, then structural strength and impact resistance are improved, but electrical conductivity deteriorates leading to charge buildup
Solution Approach 1:
The patent applies composite materials by combining thermoplastic interlayers with conductive metal coatings to create a multi-functional layer that provides both structural support and electrical conductivity. The thermoplastic matrix maintains mechanical integrity while the embedded conductive particles or coatings enable charge dissipation, resolving the contradiction between strength and conductivity.
Solution Approach 2:
The patent implements local quality by adding conductive elements specifically to the thermoplastic interlayers where charge buildup occurs. Rather than making the entire composite conductive, conductive particles, fibers, or coatings are localized within the thermoplastic layers to provide electrical pathways precisely where needed, maintaining overall structural properties while addressing the conductivity issue.
2Reliability
If metal layers are added to improve conductivity, then electrical charge dissipation is improved, but device complexity increases
Solution Approach 1:
The patent applies parameter changes by modifying the electrical conductivity parameter of the thermoplastic interlayers through addition of conductive fillers, particles, or coatings. This changes the material property of the existing layer rather than adding entirely new functional layers, thereby improving conductivity while minimizing structural complexity.
Solution Approach 2:
The patent implements multi-functionality by designing the thermoplastic interlayers to serve dual purposes: maintaining structural integrity and providing electrical conductivity. By incorporating conductive elements within the structural layers rather than adding separate conductive layers, the same layer performs both mechanical and electrical functions, reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced conductivity of the interlayers effectively dissipates electric current and charge, reducing electrical interference while maintaining structural strength and impact resistance.
Implementation Method 1
treating a surface of the interlayer material using an atmospheric-pressure plasma such that the surface of the interlayer material undergoes a surface activation
Implementation Method 2
The enhanced conductivity of the interlayers effectively dissipates electric current and charge
Data Source
Figure 1
Figure 2
Figure 3A~3C
AI summary
A method of imparting electrical conductivity on an interlayer material is disclosed. In one non-limiting example the method includes forming the interlayer material from at least one layer of fabric of thermoplastic fibers. The method further includes, treating the surface of the interlayer material using an atmospheric-pressure plasma such that the surface of the interlayer material undergoes a surface activation. Additionally, the method includes depositing a layer of conductive material on the surface of the interlayer material such that the conductive material increases a conductivity of the interlayer material.