Metal-Coated Polyimide Film Adhesion and Stability
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Solution Overview
Problem
Conventional polyimide films used in electronic materials face challenges such as inferior flexibility, bending properties, high water absorbency, and moisture expansion coefficients, especially when used in flexible printed boards and semiconductor packages, where dimensional stability is crucial. Additionally, existing methods for forming metal-laminated polyimide films with fine patterns are inadequate, leading to low adhesion reliability and environmental resistance issues.
Innovation Solution
A metal-coated polyimide film is developed with a non-thermoplastic polyimide resin containing a thermoplastic polyimide block component, allowing for a metal layer to be directly formed without adhesives, using methods like sputtering or vapor deposition, which enhances adhesion and dimensional stability while maintaining low moisture expansion and high elasticity modulus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If rigid monomers with high linearity (pyromellitic dianhydride and p-phenylene diamine) are used to produce polyimide films with high elasticity modulus and low linear expansion coefficient, then dimensional stability against heat and tension is improved, but flexibility and bending properties deteriorate
Solution Approach 1:
The patent introduces a specific structural feature (ortho-substituted aromatic hydrocarbon group) at local positions within the polyimide chain. This localized structural modification allows certain segments of the polymer chain to provide flexibility while the overall rigid monomer structure maintains dimensional stability, resolving the contradiction between rigidity and flexibility.
Solution Approach 2:
The patent creates a composite polyimide structure by incorporating ortho-substituted aromatic hydrocarbon groups into the polymer chain. This composite approach combines the dimensional stability of rigid monomers with the flexibility provided by the specific ortho-substituted structural units, achieving both properties simultaneously.
2Stability of the object's composition
If rigid monomers with high linearity are used to produce polyimide films with high elasticity modulus and low linear expansion coefficient, then dimensional stability is improved, but adhesion reliability and environmental resistance deteriorate
Solution Approach 1:
The patent introduces a specific structural feature (ortho-substituted aromatic hydrocarbon group) at local positions within the polyimide chain. This localized structural modification allows certain segments of the polymer chain to provide flexibility while the overall rigid monomer structure maintains dimensional stability, resolving the contradiction between rigidity and flexibility.
Solution Approach 2:
The patent creates a composite polyimide structure by incorporating ortho-substituted aromatic hydrocarbon groups into the polymer chain. This composite approach combines the dimensional stability of rigid monomers with the flexibility provided by the specific ortho-substituted structural units, achieving both properties simultaneously.
3Ease of manufacture
If conventional methods (adhesive lamination or sputtering) are used to form metal-laminated polyimide films, then metal layer formation is achieved, but adhesion reliability and environmental resistance deteriorate
Solution Approach 1:
The patent removes the adhesive layer from the metal lamination process by enabling direct metal deposition onto the polyimide film surface. This extraction of the adhesive component eliminates the weak interface it created, allowing direct metal-polyimide bonding through sputtering or vapor deposition, thereby improving adhesion reliability while maintaining ease of manufacture.
4Manufacturing precision
If thin copper foil is laminated on polyimide film with adhesive for fine pattern formation, then metal lamination is achieved, but adhesion reliability and environmental resistance deteriorate
Solution Approach 1:
The patent removes the adhesive layer from the metal lamination process by enabling direct metal deposition onto the polyimide film surface. This extraction of the adhesive component eliminates the weak interface it created, allowing direct metal-polyimide bonding through sputtering or vapor deposition, thereby improving adhesion reliability while maintaining ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a polyimide film with improved long-term adhesion reliability and dimensional stability, suitable for high-density packaging applications like Chip on Film (COF), by incorporating a thermoplastic polyimide block component that enhances water vapor transmission rates and productivity during the manufacturing process.
Implementation Method 1
a method in which a thin metal film is formed on the surface of polyimide film by using a sputtering apparatus or a metal vapor deposition apparatus
Implementation Method 2
a method in which a thin metal film is formed on the surface of polyimide film by using a sputtering apparatus or a metal vapor deposition apparatus
Data Source
AI summary
A metal-coated polyimide film is excellent in long-term adhesion reliability, exhibits various dimensional stabilities, and is particularly suitable for FPC, COF and TAB applications. The metal-coated polyimide film comprises a non-thermoplastic polyimide film; and a metal layer being directly formed on one surface or both surfaces of the non-thermoplastic polyimide film without using an adhesive, wherein the non-thermoplastic polyimide film contains a non-thermoplastic polyimide resin having a thermoplastic polyimide block component.