Metal Conducting Structure for Flexible Circuit Solderability
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Solution Overview
Problem
The surface properties of polymer-based conducting layers in printed circuit boards and flexible printed circuits are poor, making it difficult for solder to fully contact the conductive wire, leading to false soldering or failure to solder.
Innovation Solution
A metal conducting structure comprising a first metal conducting layer with a polymer material and metal particles, a second layer with metal particles and pores, and a third layer with a lower melting point metal material that fills the pores and connects with the first layer, enhancing solderability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If polymer material is used as conducting layer, then flexibility is improved, but solderability deteriorates
Solution Approach 1:
The patent uses a composite structure consisting of a polymer-based conducting layer combined with metal particles (silver, copper, or aluminum) to create a material that maintains the flexibility of polymers while adding the solderability of metals. The metal particles are dispersed within the polymer matrix, allowing the conducting layer to be both flexible and solderable.
Solution Approach 2:
The patent applies different properties to different parts of the conducting layer: the polymer matrix provides flexibility and mechanical strength, while the metal particles provide electrical conductivity and solderability. This local differentiation of material properties allows the single layer to simultaneously achieve both flexibility and good solder contact.
2Reliability
If copper foil is used as conducting layer, then solderability is improved, but flexibility deteriorates
Solution Approach 1:
The patent replaces rigid copper foil with a composite material consisting of a flexible polymer matrix containing metal particles. This composite maintains the essential electrical conductivity and solderability of copper while adding the flexibility characteristic of polymers, enabling use in flexible printed circuits.
Solution Approach 2:
The patent substitutes the solid, rigid metallic structure of copper foil with a particulate composite system where metal particles are dispersed in a polymer matrix. This replacement changes the mechanical behavior from rigid to flexible while maintaining electrical functionality through the interconnected metal particle network.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution achieves excellent solderability and reliability, with a yield rate of 100% in peel tests and flexibility, suitable for applications in flexible displays and high-power electronic chips.
Implementation Method 1
the pores of the second metal conducting layer are filled with a metal material of the third metal conducting layer
Implementation Method 2
the pores of the second metal conducting layer are filled with a metal material of the third metal conducting layer
Data Source
AI summary
A metal conducting structure includes a first metal conducting layer, a second metal conducting layer, and a third metal conducting layer. The first metal conducting layer consists of a first polymer material and first metal particles. The first metal conducting layer is covered by the second metal conducting layer which is a structure with pores, the structure consists of second metal particles. The second metal conducting layer is covered by the third metal conducting layer. The pores of the second metal conducting layer are filled with a metal material of the third metal conducting layer.