Metal-Core LED Package Grooves for Heat Dissipation and Light Output
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Solution Overview
Problem
Existing LED packages face challenges in effectively dissipating heat generated by LED chips while maintaining light emitting efficiency, as traditional heatsink attachment methods are complex, costly, and can obstruct light emission.
Innovation Solution
A metal core printed circuit board with an insulating layer, circuit patterns, and a light-emitting diode electrically connected to the circuit patterns, featuring grooves on the metal plate to enhance heat dissipation without reducing light efficiency, achieved through a manufacturing process involving a metal core printed circuit board with selectively formed grooves and a reflective layer to maximize heat sink effect.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heatsink member is attached to the PCB, then heat dissipation is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the heatsink function with the PCB structure by forming grooves directly on the metal plate of the PCB. This integration eliminates the need for a separate heatsink member and its attachment process, thereby improving heat dissipation while reducing device complexity and manufacturing cost.
Solution Approach 2:
The patent creates grooves on the metal plate surface, adding a dimensional feature to enhance heat dissipation. The grooves provide increased surface area and improved thermal pathways without requiring additional components, resolving the contradiction between heat dissipation performance and structural simplicity.
2Temperature
If a heatsink member is attached to the PCB, then heat dissipation is improved, but manufacturing cost increases
Solution Approach 1:
By combining the heatsink functionality into the PCB structure itself through groove formation, the patent eliminates the need for purchasing and assembling separate heatsink components. This reduces manufacturing cost while maintaining effective heat dissipation performance.
3Temperature
If a heatsink member is attached to the PCB, then heat dissipation is improved, but light emitting efficiency is reduced
Solution Approach 1:
The patent segments the metal plate surface by creating grooves, which allows heat dissipation pathways to be established without creating a solid barrier. The grooved structure provides thermal pathways while leaving sufficient open space for light emission, thus improving heat dissipation without significantly reducing light emitting efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat from LED chips, improving thermal reliability and light emitting efficiency without increasing costs or obstructing light emission, thus enhancing the performance and reliability of LED packages.
Implementation Method 1
a metal plate having grooves... allowing heat generated from an LED chip to be effectively sunk
Implementation Method 2
The groove pattern allows heat to be effectively sunk without reducing light emitting efficiency... maximize heat sink effect
Data Source
AI summary
An LED package is provided. The LED package comprises a metal plate, circuit patterns, and an LED. The metal plate comprises grooves. The insulating layer is formed on the metal plate. The circuit patterns are formed on the insulating layer. The LED is electrically connected with the circuit pattern on the insulating layer.