Metal-Covered Pressure Sensor Overmoulding for High-Pressure Reliability
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Solution Overview
Problem
Conventional board mount pressure sensors face limitations in high-temperature and high-pressure environments due to unreliable adhesive joints and failure to meet safety requirements, particularly in medical devices.
Innovation Solution
A pressure sensor module with gel encapsulation, a metal cover, and plastic overmoulding, using substrates like FR4 or tFN, metal covers of stainless steel or aluminum, and plastic overmoulding of engineering plastics, provides a robust and reliable assembly with minimal joints, ensuring waterproofing and mechanical integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive joints are used in conventional board mount pressure sensors, then assembly is simplified, but reliability deteriorates in high-temperature and high-pressure environments
Solution Approach 1:
The patent combines multiple components (substrate, sensor element, metal cover, and overmoulding) into an integrated assembly where the overmoulding serves dual functions as both structural support and sealing element, eliminating the need for separate adhesive joints and improving reliability in harsh environments
Solution Approach 2:
The patent employs composite construction by integrating a metal cover with polymer overmoulding on a substrate, creating a hybrid structure that leverages the strength of metal and the sealing properties of polymer materials to achieve both mechanical integrity and environmental protection without relying on adhesive joints
2Adaptability or versatility
If multiple components are used in pressure sensor modules, then functionality is improved, but device complexity increases
Solution Approach 1:
The overmoulding component performs multiple functions simultaneously: it provides mechanical support, creates sealing barriers, protects the sensor element, and enables pressure transmission through its deformable nature, thereby reducing the need for separate dedicated components for each function
Solution Approach 2:
The patent implements a nested structure where the sensor element is enclosed within the metal cover, which is in turn covered by the overmoulding, creating a compact hierarchical assembly that maximizes functionality within a minimal spatial footprint
Data Source
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AI summary
A device for sensing characteristics of the environment and/or various media such as pressure is provided. The assembled device may include a sensor module having gel encapsulation, metal covers, and plastic overmoulding. Associated methods for assembling devices having overmoulded pressure sensor modules with gel encapsulation and metal covers are provided.