Metal-Diamond Composite Thermal Interface Material

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Solution Overview

Problem

Conventional thermal interface materials have low thermal conductivities, limiting their ability to effectively remove heat from heat-generating components to heat-removing devices.

Innovation Solution

A thermal interface material comprising metal-diamond composite nanoparticles, where each nanoparticle has a diamond core surrounded by a metal shell with a low fusion temperature, is applied between surfaces and heated to fuse the metal shells, creating a high thermal conductivity interface with the diamond cores embedded in a metal layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional thermal greases or epoxies are used as thermal interface materials, then the application process is simple, but the thermal conductivity is low (1-5 W/m·K)

Engineering Contradiction:
Improveapplication simplicityVSAvoidthermal conductivity
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The patent uses metal-diamond composite nanoparticles where diamond cores (high thermal conductivity) are surrounded by metal shells (low fusion temperature). This composite structure combines the high thermal conductivity of diamond with the low melting point of metal, enabling both high thermal conductivity in the final interface and ease of application through low-temperature processing

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent changes the physical state of the metal shell from solid to liquid by heating to its fusion temperature, transforming the nanoparticle structure from discrete particles to a fused metal layer with embedded diamond cores. This phase transition enables the material to flow and conform to surfaces during application, then solidify to create a rigid thermal interface

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly enhances thermal conductivity, allowing for efficient heat removal and improved component packing density while maintaining mechanical integrity and resistance to vibrations and shock.

Implementation Method 1

heating the thermal interface material to the fusion temperature of the metal shells. The heating causes the metal shells to fuse together and to the two surfaces

Methodology Applied
Scientific EffectFusion: Melting

Implementation Method 2

The high thermal conductivity of the embedded diamond cores greatly enhance the thermal conductivity of the thermal interface

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8900704B1Nanostructured metal-diamond composite thermal interface material (TIM) with improved thermal conductivity
Publication Date: 2014.12.02 KUPRION INC
  • US8900704B1 patent drawing
  • US8900704B1 patent drawing
  • US8900704B1 patent drawing

AI summary

Various aspects of the disclosure provide thermal interface materials having high thermal conductivities. In one aspect, a thermal interface material comprises metal-diamond composite nanoparticles, where each composite nanoparticle comprises a diamond core surrounded by a metal shell with a low fusion temperature. In one aspect, a thermal interface is formed between two surfaces (e.g., surfaces of a heat source and heat sink) by applying the thermal interface material between the two surfaces and heating the thermal interface material to the fusion temperature of the metal shells. The heating causes the metal shells to fuse together and to the two surfaces. The fusion results in a thermal interface between the two surfaces comprising a metal layer formed by the fused metal shells and the diamond cores embedded within the metal layer. The high thermal conductivity of the embedded diamond cores greatly enhance the thermal conductivity of the thermal interface.