Metal Dummy Substrate for Sputtering Apparatus
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional inline sputtering apparatuses face issues with glass substrate cracking and high costs due to frequent activation and deactivation, requiring multiple glass substrates and leading to reduced productivity and increased costs, especially with the upsizing of display panels.
Innovation Solution
A metal dummy substrate with an opening portion is used, covering the contact portion of the transfer device, allowing for efficient activation, retention, and deactivation of the sputtering apparatus, reducing stress and extending the substrate's lifespan without the need for frequent replacements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glass substrates are used as dummy substrates in conventional sputtering apparatuses, then the apparatus can be operated for activation and deactivation, but the glass substrates crack due to deposition stress, requiring frequent replacements and reducing productivity
Solution Approach 1:
The invention changes the material parameter of the dummy substrate from glass to metal (such as stainless steel, aluminum, or copper), fundamentally altering the mechanical properties including stress resistance, thermal conductivity, and durability. This material substitution eliminates the cracking problem that occurs with glass substrates under deposition stress, enabling the dummy substrate to withstand repeated use during apparatus activation and deactivation cycles without failure.
Solution Approach 2:
The dummy substrate is designed as a composite structure combining a metal base material with a surface coating layer. The metal provides mechanical strength and stress resistance, while the surface coating (such as fluorocarbon or silicon oxide) provides low adhesion properties to prevent film adhesion. This composite structure optimizes both structural durability and functional performance, allowing the substrate to withstand repeated thermal and mechanical stress without cracking.
2Productivity
If multiple glass substrates are kept for frequent replacements, then the apparatus can maintain operation, but the cost increases and storage space is required
Solution Approach 1:
The invention changes the material parameter of the dummy substrate from glass to metal, fundamentally altering the mechanical properties including stress resistance, thermal conductivity, and durability. This material substitution eliminates the cracking problem that occurs with glass substrates under deposition stress, enabling the dummy substrate to withstand repeated use during apparatus activation and deactivation cycles without failure.
Solution Approach 2:
The invention enables the dummy substrate to be reused multiple times through its enhanced durability and resistance to deposition stress. Instead of discarding cracked glass substrates and replacing them with new ones, the metal-based dummy substrate can be cleaned and reused, recovering the investment and eliminating the need to maintain multiple substrates in inventory.
3Loss of time
If the vacuum region is opened to air at high temperatures, then the apparatus can be deactivated quickly, but the heated portion surface oxidizes, making subsequent sputtering unstable
Solution Approach 1:
The metal-based dummy substrate with enhanced thermal properties enables the apparatus to self-regulate the cooling process. The substrate can be left in the vacuum chamber to cool down passively after deposition, utilizing its thermal mass and conductivity to gradually reduce temperature without active intervention. This self-cooling mechanism allows the chamber to be opened to air only when the substrate and chamber are at safe temperatures, preventing oxidation while maintaining efficient deactivation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables faster and more cost-effective operation of the sputtering apparatus by preventing glass cracking, increasing the substrate's usage frequency, and reducing downtime, thus enhancing productivity and lowering costs.
Implementation Method 1
a compound thin film is deposited on surfaces of substrates by the sputtering method
Data Source
AI summary
This dummy substrate is for use in an inline reactive sputtering apparatus. The main unit thereof is made of a rectangular-plate-like frame structure in which an opening portion in a rectangular shape is formed in a metal plate in a similar shape. It is configured such that a contact portion of a carrier with the main unit is covered with the main unit. As a result, even while the sputtering apparatus is in operation, there is no possibility of the occurrence of undesirable situations such as glass cracking, making it possible to significantly increase the number of times the dummy substrate is used. Furthermore, the dummy substrate continues to cover the contact portion with the carrier. Thereby, it is possible to prevent deposition of a substance left in a sputter deposition chamber, especially a compound thin film, on the contact portion of the carrier with the substrate. Therefore, it is possible to prevent undesirable situations such as an abnormal discharge due to the deposition of the compound thin film. As a result of these, it is possible to start (activate) an apparatus that deposits a compound thin film by the sputtering method, retain and modify a deposition condition in the apparatus, and stop (deactivate) the apparatus in a shorter time, and more efficiently and at a lower cost than before.