Metal-Filled DBC Substrate Indentations for Delamination Resistance

The patent applies local quality by creating dimples at specific locations on the ceramic substrate where CTE mismatch stress concentrates. These localized indentations are then filled with metal having CTE matched to copper, providing localized stress compensation exactly where needed at the bond interface, rather than requiring uniform modification across the entire substrate.

The patent employs composite materials by combining ceramic substrate, copper layers, and metal-filled dimples into a multi-material structure. The metal filler material is specifically selected to have CTE properties that bridge the gap between ceramic and copper, creating a composite bond interface that accommodates thermal expansion differences and prevents delamination.

The patent applies parameter changes by modifying the dimple fill material from void or low-conductivity material to high-conductivity metal. This changes the thermal conductivity parameter of the dimple region from poor to excellent, allowing the dimples to serve their mechanical stress-relief function while maintaining optimal thermal conduction pathways through the substrate.

The patent uses composite materials by filling the dimples with metal that provides both mechanical anchoring and thermal conduction. The metal-filled dimples create a composite structure where the metal serves dual purposes: mechanically anchoring the copper layer to prevent delamination and thermally conducting heat away from the bond interface, thus improving both reliability and thermal performance simultaneously.