Metal-Filled Recessed Substrate for Electronic Heat Dissipation

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Solution Overview

Problem

Existing substrates used for mounting electronic elements lack sufficient thermal conductivity to effectively dissipate heat generated by these components, leading to inefficiencies in heat management.

Innovation Solution

The substrate design incorporates recessed portions on both surfaces filled with metal members having higher thermal conductivity than the base material, along with electrical conductor film layers, to enhance heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the base material is used as the substrate, then the substrate can be manufactured with standard materials, but the thermal conductivity is insufficient to effectively dissipate heat

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidsubstrate damage risk

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The substrate employs a composite structure combining a base material with metal members having higher thermal conductivity. The metal members are embedded within recessed portions of the base, creating a hybrid material system that leverages the structural properties of the base while incorporating the superior thermal conductivity of metals to enhance overall heat dissipation performance and reduce substrate damage risk

Inventive Principle:

Principle #40Composite materials

2Temperature

If metal members with higher thermal conductivity are embedded in the base, then heat dissipation performance is improved, but the manufacturing process becomes more complex

Engineering Contradiction:

Improvethermal conductivityVSAvoidsubstrate manufacturing complexity

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The substrate manufacturing process is segmented into distinct stages: forming recessed portions in the base material, placing metal members into these recessed portions, and completing the assembly. This segmentation allows for modular manufacturing where the base and metal members can be prepared separately and then integrated, simplifying the overall production process while achieving enhanced thermal conductivity

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The increased thermal conductivity improves heat dissipation performance, reducing the likelihood of substrate damage and enhancing the efficiency of heat transfer to cooling components.

Implementation Method 1

a coefficient of thermal conductivity of the first metal member and a coefficient of thermal conductivity of the second metal member are higher than a coefficient of thermal conductivity of the base

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250392096A1Substrate, electronic device, electronic module, and module device

Publication Date: 2025.12.25 KYOCERA CORP

AI summary

To increase the coefficient of thermal conductivity. A substrate includes a base including a first surface, a second surface located on an opposite side of the first surface, at least one first recessed portion opening to the first surface, and at least one second recessed portion opening to the second surface; a first metal member located inside the at least one first recessed portion; and a second metal member located inside the at least one second recessed portion, in which the coefficient of thermal conductivity of the first metal member and the coefficient of thermal conductivity of the second metal member are higher than the coefficient of thermal conductivity of the base.