Carrier-Attached Metal Foil Alignment Marks for One-Stage Circuiting
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Solution Overview
Problem
Existing methods for forming fine circuits on carrier-attached metal foils require a two-stage process, which is complex and prone to yield loss due to the need for high positioning accuracy after forming rough circuits, as alignment marks suitable for carrier-attached metal foils are not available.
Innovation Solution
A carrier-attached metal foil with alignment marks on its surface allows simultaneous exposure for both rough and fine circuits using the same alignment marks, enabling a one-stage circuit formation process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a two-stage process is used to form fine circuits on carrier-attached metal foils, then circuit formation is possible, but the process becomes complex and yield is reduced due to positioning accuracy requirements
Solution Approach 1:
Alignment marks are formed on the carrier surface before metal foil lamination, preparing the positioning reference in advance. This preliminary action eliminates the need for complex post-lamination positioning procedures, allowing direct one-stage circuit formation while maintaining high positioning accuracy.
Solution Approach 2:
The alignment marking function is extracted from the metal foil and transferred to the carrier substrate. By forming alignment marks directly on the carrier before metal foil attachment, the patent removes the complexity of positioning operations from the subsequent circuit formation process, enabling simplified one-stage manufacturing.
2Productivity
If alignment marks are not provided on carrier-attached metal foils, then the structure remains simple, but simultaneous exposure for rough and fine circuits cannot be performed
Solution Approach 1:
Alignment marks are created on the carrier surface before metal foil lamination and circuit formation. This preliminary preparation enables both rough and fine circuit exposure to be performed simultaneously with accurate positioning, dramatically improving productivity without sacrificing manufacturing precision.
3Productivity
If alignment marks are formed on the carrier surface before metal foil lamination, then one-stage circuit formation is enabled, but additional processing steps are required
Solution Approach 1:
Alignment marks are formed on the carrier before metal foil lamination, enabling one-stage circuit formation that improves productivity and yield. Although this adds an initial processing step, it eliminates the need for subsequent complex positioning operations between multiple exposure stages, ultimately simplifying the overall manufacturing process.
Data Source
AI summary
Provided is a carrier-attached metal foil with which both exposure for rough circuits and exposure for fine circuits in wiring formation can be performed based on the same alignment marks, and as a result, rough circuits and fine circuits can be simultaneously formed in a one-stage circuit formation process. This carrier-attached metal foil is a carrier-attached metal foil including a carrier, a release layer provided on at least one surface of the carrier, and a metal layer provided on the release layer, wherein the carrier-attached metal foil includes: a wiring region throughout which the carrier, the release layer, and the metal layer are present; and at least two positioning regions provided on the at least one surface of the carrier-attached metal foil and forming alignment marks used for positioning in wiring formation involving exposure and development.