Metal Foil With Filler-Containing Resin Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for manufacturing metal foils with insulating layers are limited by the need for large molds to achieve a smooth surface, restricting the size of the insulating layers that can be formed and making it difficult to achieve uniformity and reproducibility, especially for large areas.
Innovation Solution
A metal foil with a filler-containing resin layer is developed, comprising insulating filler and a binder resin, where the resin layer is applied and cured on a smooth surface, achieving a gloss exceeding 400 and surface roughness of 10 nm or less, allowing for a thin, uniform, and highly reproducible insulating layer with a thickness of 0.1 μm to 3.0 μm, which is homogeneously dispersed and free from surface irregularities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a composite-type insulating layer is applied thinly to achieve a smooth surface, then the thickness is reduced, but the surface becomes rough due to protruding filler particles
Solution Approach 1:
The invention changes the particle size parameter of the insulating filler to sub-micron level (0.1-1.0 μm), which allows the filler to be densely packed and evenly distributed in the resin layer. This parameter change enables achieving both thin layer thickness and smooth surface without the protrusion problems encountered with larger particles
Solution Approach 2:
The invention uses a composite material system combining sub-micron insulating filler particles with a resin matrix. This composite structure allows the filler particles to be uniformly dispersed and embedded within the resin, creating a smooth surface while maintaining the insulating function, thus resolving the contradiction between thinness and surface smoothness
2Manufacturing precision
If a mold is used to press the surface of the insulating layer to make it smooth, then the surface smoothness is improved, but the manufacturing complexity and area limitations increase
Solution Approach 1:
The invention extracts and removes the molding step from the manufacturing process. By using sub-micron filler particles that naturally form smooth surfaces when applied thinly, the need for subsequent molding operations is eliminated, thereby reducing manufacturing complexity while maintaining surface smoothness
Solution Approach 2:
The invention performs the surface smoothing action during the coating application stage itself, rather than requiring a separate subsequent step. The sub-micron filler particles inherently create a smooth surface when properly applied and cured, so no additional molding or pressing operations are needed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting metal foil with a filler-containing resin layer provides an extremely smooth insulating or dielectric layer that reduces electric current leakage and enhances the reliability and stability of electronic circuits and devices, while enabling the formation of thin, uniform layers over a wide area with excellent reproducibility.
Implementation Method 1
drying the coated film
Implementation Method 2
semi-curing or full-curing the dried coated film through heat treatment
Data Source
AI summary
A metal foil is provided with a filler-containing resin layer that is thin and has a smooth surface as a metal foil provided with an insulating layer. The filler-containing resin layer having a thickness of 0.1 μm to 3.0 μM, the gloss at the surface of the filler-containing resin layer is 200 or more, and the surface roughness (Ra) measured by an atomic force microscope in a measurement area of 5 μm×5 μM on the filler-containing resin layer is 25 nm or less is stacked on the smooth surface of the metal foil having a gloss exceeding 400 and surface roughness (Ra) measured by an atomic force microscope in a measurement area of 5 μm×5 μm of 10 nm or less.