Metal-Foil Laminated Film for Low-Energy Wafer Separation

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Solution Overview

Problem

Existing methods for separating semiconductor members from support members in SIP-type packages face issues such as thermal damage, complex processes, and the need for expensive equipment, particularly when using laser irradiation for separation.

Innovation Solution

A laminated film comprising a metal foil sandwiched between two curable resin layers is used to form a temporary fixing material layer, allowing for separation with lower light irradiation energy by suppressing heat diffusion and promoting temperature increase.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If heating the temporary fixing material layer is used to separate the semiconductor member from the support member, then separation can be achieved, but thermal damage occurs in the semiconductor wafer and product yield is lowered

Engineering Contradiction:

Improveseparation qualityVSAvoidthermal damage

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The temporary fixing material layer is divided into multiple functional layers: a lower adhesive layer for bonding to the support member, an intermediate metal foil layer for selective light absorption, and an upper adhesive layer for bonding to the semiconductor member. This segmentation allows the metal layer to absorb light energy and generate heat locally without transmitting thermal damage to the semiconductor wafer.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The metal foil layer acts as an intermediary that absorbs light energy and converts it to thermal energy, mediating the separation process. This intermediary layer enables separation through controlled thermal expansion and adhesive breakdown while protecting the semiconductor member from direct thermal damage by confining heat generation to the adhesive layers.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If laser beam irradiation is used to separate the semiconductor member, then separation can be achieved, but the area of irradiation is narrow requiring repeated irradiation and highly expensive apparatuses are required

Engineering Contradiction:

Improveseparation qualityVSAvoidapparatus cost and process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces complex laser beam systems with a simpler broad-spectrum light source (such as halogen lamp or LED) that can illuminate the entire semiconductor member simultaneously. The metal foil layer in the temporary fixing material layer performs the function of selective energy absorption, eliminating the need for precise laser focus control and expensive laser apparatus.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The metal foil layer serves multiple functions: (1) selective light absorption to generate heat, (2) thermal conduction to heat the adhesive layers uniformly, (3) mechanical reinforcement of the temporary fixing material layer, and (4) barrier to prevent direct light transmission to the semiconductor member. This multi-functionality simplifies the overall separation system.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The laminated film enables efficient separation of semiconductor members from support members with reduced thermal stress and simplified processes, using incoherent light sources like xenon lamps.

Implementation Method 1

a laminated film including a metal foil and two curable resin layers having the metal foil interposed therebetween is used as a temporary fixing material layer, a temporarily fixed semiconductor member and a support member can be separated by lower light irradiation energy

Methodology Applied

Scientific EffectLight absorption and heat generation: Absorption (EM radiation)

Implementation Method 2

diffusion of the heat generated at the metal foil in the temporary fixing material layer by light irradiation to the support member can be suppressed, and temperature increase of the temporary fixing material layer can be promoted by lower light irradiation energy

Methodology Applied

Scientific EffectThermal conduction suppression and heat concentration: Thermal Insulation

Data Source

PatentUS12543538B2Temporary fixation layered film and production method therefor, temporary fixation layered body, and semiconductor device production method

Publication Date: 2026.02.03 RESONAC CORP

AI summary

A method for producing a laminated film for temporary fixation of a semiconductor member to a support member includes providing a first curable resin layer on one surface of a metal foil and providing a second curable resin layer on the other surface of the metal foil to obtain the laminated film. A laminated film used for temporarily fixing a semiconductor member to a support member includes a first curable resin layer, a metal foil, and a second curable resin layer laminated in sequence.