Metal Frame Anodizing for Cover Glass Bonding and Durability
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Solution Overview
Problem
The use of nickel-containing pore sealing agents in anodizing processes for metal frames in electronic devices reduces the surface energy and adhesiveness, making it difficult to bond structures like cover glass effectively due to hazardous nickel components and the need for separate washing and elution processes.
Innovation Solution
Implement a nickel-free anodized layer in the bonding area of the metal frame, combined with a nickel-containing layer in the exposed area, to maintain durability and improve adhesiveness by using a nickel-free pore sealing agent in the bonding area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a nickel-containing pore sealing agent is used in the anodizing process, then the durability and erosion resistance of the metal frame is improved, but the surface energy and adhesiveness of the metal frame surface deteriorates
Solution Approach 1:
The patent applies different pore sealing treatments to different areas of the metal frame. The first area (exposed area) receives nickel-containing pore sealing for durability, while the second area (bonding area) receives nickel-free pore sealing for adhesiveness. This local differentiation resolves the contradiction by optimizing each area for its specific function.
Solution Approach 2:
The metal frame surface is divided into two distinct areas with different functional requirements. The segmentation allows independent optimization of durability in the exposed area and adhesiveness in the bonding area, eliminating the need to choose between the two conflicting properties for the entire surface.
2Reliability
If a nickel-containing pore sealing agent is used, then the erosion resistance of the metal frame is improved, but the complexity of the manufacturing process increases due to additional washing and elution steps
Solution Approach 1:
By applying nickel-containing pore sealing only to the exposed area where erosion resistance is needed, and nickel-free pore sealing to the bonding area, the patent eliminates the need for washing and elution steps that would be required if nickel-containing agent was applied to the entire surface. This local quality approach reduces process complexity while maintaining erosion resistance.
3Weight of stationary object
If the thickness of the bezel is decreased to achieve bezel-less design, then the weight of the electronic device is reduced and display screen size is increased, but the bonding strength between the cover glass and metal frame deteriorates
Solution Approach 1:
The patent changes the chemical composition parameter of the pore sealing agent in the bonding area by using a nickel-free agent, which maintains higher surface energy and adhesiveness. This parameter change ensures adequate bonding strength even when the bonding area is reduced due to thinner bezel design.
Solution Approach 2:
The bonding area receives special nickel-free pore sealing treatment to maintain high adhesiveness, while other areas receive conventional nickel-containing treatment. This local quality optimization ensures bonding strength is preserved in the critical bonding area despite overall reduction in bezel thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the adhesiveness of bonding areas while maintaining the durability of the electronic device's appearance, ensuring effective bonding without the drawbacks of nickel-containing agents.
Implementation Method 1
The anodizing process may mean an electrochemical process that forms an oxide film (Al 2 O 3) on the aluminum metal
Implementation Method 2
The anodizing process may mean an electrochemical process that forms an oxide film (Al 2 O 3) on the aluminum metal
Implementation Method 3
a pore sealing process of filling micropores in the oxide film
Data Source
Figure 1A
Figure 1B
Figure 1C
AI summary
An electronic device according to an embodiment may include cover glass and a housing on which the cover glass is seated. The housing includes a metal frame formed of a metal material, and on the metal frame, a seating surface for mounting the cover glass may be formed. The metal frame may include: a first region forming at least a portion of a side surface of the electronic device; and a second region to which the cover glass is attached, wherein an anodizing layer including nickel (Ni) may be arranged in the first region, and an anodizing layer that does not include nickel may be arranged in the second region. Various other embodiments identified from the specification are possible.