Exterior Metal Frame Antenna ESD Protection via Composite Support
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Solution Overview
Problem
Electronic devices with exterior metal frames as antenna radiators face issues with static electricity discharge, which can damage high-speed data processing units on the PCB, compromising their functionality.
Innovation Solution
Incorporating a support structure with both metal and non-metal regions, and electric paths that connect the exterior metal frame to the PCB, allowing static electricity to be directed away from sensitive components, thereby preventing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an exterior metal frame is used as an antenna radiator, then RF performance is improved, but static electricity can be introduced into the housing and transferred to the PCB causing damage
Solution Approach 1:
The support structure is divided into a metal region and a non-metal region, creating distinct zones with different electrical properties. The non-metal region acts as an insulating barrier that segments the electrical path, preventing static electricity from reaching the PCB while allowing the metal region to maintain RF performance.
Solution Approach 2:
The non-metal region of the support structure serves as an intermediary element between the metal frame and the PCB. This intermediary blocks the transfer of static electricity while still providing structural support, thus protecting the PCB without compromising the antenna functionality of the metal frame.
2Strength
If a metal support structure is used to support the PCB and metal frame, then structural strength is improved, but static electricity can be transferred to the PCB through the metal support
Solution Approach 1:
The support structure uses a composite design combining metal and non-metal regions. The metal region provides the necessary structural strength and support, while the non-metal region provides electrical insulation to block static electricity transfer, achieving both mechanical and electrical requirements simultaneously.
3Reliability
If the metal frame is electrically connected to the PCB for antenna functionality, then RF performance is improved, but static electricity discharge can damage high-speed data processing units
Solution Approach 1:
The support structure has different electrical properties in different regions: the metal region provides electrical connectivity for RF performance, while the non-metal region provides insulation to protect against static electricity discharge. This local differentiation of material properties allows simultaneous achievement of RF functionality and ESD protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances electrostatic discharge (ESD) performance while maintaining radio frequency (RF) performance, ensuring the integrity of data processing units by routing static electricity safely through the support structure.
Implementation Method 1
a first electric path that is electrically connected to the at least one exterior metal frame and the printed circuit board with each other... a second electric path that is disposed between the printed circuit board and the metal region of the support structure and is electrically connected with the first electric path
Data Source
AI summary
Disclosed is an electronic device that includes a housing; a printed circuit board disposed within the housing; a communication circuit disposed on the printed circuit board; at least one exterior metal frame forming at least a part of the housing, and is electrically connected with the communication circuit; a first electric path that electrically connecting the at least one exterior metal frame and the printed circuit board with each other; a support structure including a metal region and a non-metal region, and supporting the printed circuit board and/or the at least one exterior metal frame; and a second electric path disposed between the printed circuit board and the metal region of the support structure and is electrically connected with the first electric path.