Metal-Frame Multilayer Capacitor Structure for Low ESL Reliability
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges with thermal and mechanical stress transmission from substrates, leading to increased equivalent series inductance (ESL) due to metal frames bonded to conducting parts, and potential damage from substrate deformation.
Innovation Solution
A multilayer electronic component design featuring first and second metal frames with support, extension, and mounting portions that create a gap between the capacitor and substrate, reducing direct stress transmission and current path, thereby improving thermal and mechanical reliability while maintaining low ESL.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal frame is bonded to a multilayer ceramic capacitor to secure a gap between the capacitor and mounting substrate, then thermal and mechanical stress from the substrate is not directly transmitted to the capacitor, but the current path increases and equivalent series inductance (ESL) increases
Solution Approach 1:
The metal frame is divided into a support portion that contacts the external electrode and an extension portion that extends outward. This segmentation allows the frame to provide mechanical support and create a gap from the substrate while minimizing the current path by confining the conductive connection to only the necessary support portion area.
Solution Approach 2:
The metal frame structure is designed with different portions serving different functions: the support portion provides electrical connection with minimal area to reduce ESL, while the extension portion provides mechanical support and gap creation. This local differentiation optimizes both electrical and mechanical performance.
2Ease of manufacture
If the body of the multilayer electronic component is in direct contact with the substrate by solders, then mounting is simplified, but heat or mechanical deformation from the substrate is directly transmitted to the capacitor, reducing reliability
Solution Approach 1:
The metal frame acts as an intermediary element between the capacitor body and the mounting substrate. It provides mechanical support and creates a gap that prevents direct transmission of thermal and mechanical stress, while still allowing for simplified mounting processes through its extension portions that can be easily connected to the substrate.
3Strength
If the metal frame has a certain thickness and is bonded to a conducting part such as an external electrode, then structural support is provided, but the current path increases and equivalent series inductance (ESL) increases
Solution Approach 1:
The metal frame is segmented into a support portion with minimal thickness for electrical connection and an extension portion with greater thickness for structural support. This segmentation allows the frame to provide necessary structural strength while minimizing the current path area and thus reducing ESL.
Solution Approach 2:
The metal frame exhibits local quality variations in thickness: the support portion has minimal thickness to reduce current path and ESL, while the extension portion has sufficient thickness to provide structural support. This localized differentiation resolves the contradiction between structural strength and low ESL.
Data Source
AI summary
A multilayer electronic component includes a capacitor including a body comprising a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer therebetween, first and second external electrodes disposed on the body, a first metal frame disposed on the first external electrode of the capacitor, and a second metal frame disposed on the second external electrode of the capacitor. W>L, wherein L is a dimension of the capacitor in a second direction and W is a dimension of the capacitor in a third direction, and the first and second metal frames include support portions in contact with the first and second external electrodes, extension portions extending from the support portions in a first direction and disposed to be spaced apart from the body and the first and second external electrodes, and mounting portions extending from one ends of the extension portion in the second direction.