Metal Frame Power Die Molding for Lower-Handling Assembly
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Solution Overview
Problem
The increasing demand for electronic components in various industries requires solutions that reduce the complexity and cost of manufacturing molded electronic devices, particularly those incorporating semiconductor dies with complex chip layouts and external terminals.
Innovation Solution
A method involving the use of metallic frames with preformed die pads and contact pads, where semiconductor dies are attached to die pads and contact pads without direct physical or electrical connections, encapsulated in a mold compound, and then severed to form individual devices, simplifying the manufacturing process and reducing material waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional manufacturing methods are used for molded electronic devices, then device functionality is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The manufacturing process is segmented into distinct stages: preparing metallic frames with die pads, attaching semiconductor dies, vertically aligning frames, encapsulating in mold compound, and severing connectors. This segmentation allows each stage to be optimized independently, reducing overall manufacturing complexity despite complex chip layouts.
Solution Approach 2:
Metallic frames with die pads and connectors are prepared in advance before semiconductor dies are attached. This preliminary preparation of frames enables standardized, repeatable attachment processes and simplifies the overall manufacturing workflow by pre-organizing all necessary components and connections.
2Manufacturing precision
If semiconductor dies are handled individually during assembly, then precise placement is achieved, but handling and breakage risk increase
Solution Approach 1:
Multiple semiconductor dies are attached simultaneously to metallic frames in a single assembly operation. This merging of multiple dies into one process step maintains precise placement through standardized attachment procedures while reducing handling operations, thereby minimizing breakage risk and improving die integrity.
Solution Approach 2:
Metallic frames with die pads serve as intermediary structures that hold multiple semiconductor dies during assembly and encapsulation. These frames provide mechanical support and precise positioning, allowing dies to be handled as a group rather than individually, thus reducing breakage while maintaining placement precision.
3Reliability
If complex encapsulation processes are used to protect semiconductor dies, then device reliability is improved, but manufacturing complexity increases
Solution Approach 1:
Metallic frames with connectors are prepared in advance with all necessary structural elements in place before encapsulation. This preliminary preparation creates a standardized substrate that simplifies the encapsulation process, allowing mold compound to be applied uniformly while maintaining reliable protection of semiconductor dies.
Solution Approach 2:
The metallic frames serve multiple functions: providing mechanical support for dies, establishing electrical connections through die pads and connectors, and serving as a standardized base for encapsulation. This multi-functionality reduces the need for additional specialized components or processes, simplifying manufacturing while ensuring reliable device protection.
4Reliability
If traditional molding processes are used, then device encapsulation is achieved, but production efficiency decreases
Solution Approach 1:
Multiple semiconductor dies attached to metallic frames are encapsulated simultaneously in a single molding operation. This combined encapsulation process maintains high encapsulation quality through standardized mold compound application while dramatically increasing production efficiency by processing multiple devices in parallel rather than sequentially.
Data Source
AI summary
A method for producing a molded electronic devices includes providing a first metallic frame including a plurality of die pads and a plurality of first connectors that hold the die pads in place. A vertical power semiconductor die is attached to each die pad. One or more second metallic frames are vertically aligned with the first metallic frame. Each second metallic frame includes a plurality of first contact pads and a plurality of second connectors that hold the first contact pads in place. Each of the first contact pads is attached to a load terminal of one of the vertical power semiconductor dies without any direct physical or electrical connection between the first metallic frame and the second metallic frame. The vertical power semiconductor dies are encapsulated in a mold compound. The first connectors and the second connectors are severed to yield individual molded electronic devices.