Metal Frame and Lid Compartment Shielding for Durable EMI Isolation

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing semiconductor device shielding methods are complex, costly, and prone to durability issues, particularly with encapsulant limitations affecting thermal release and susceptibility to peeling, which complicates intra-package interference mitigation.

Innovation Solution

A compartment shielding mechanism using a metal frame and cap is implemented, eliminating the need for encapsulant and enhancing reliability by forming a robust shield around semiconductor components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If conductive layer is sputtered onto molding compound to form shielding layer, then EMI shielding is achieved, but manufacturing complexity increases and durability decreases

Engineering Contradiction:

ImproveEMI shieldingVSAvoidmanufacturing complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The invention divides the shielding structure into separate compartments within the encapsulant, with each compartment containing specific components and having its own conductive shielding layer. This segmentation allows for simplified manufacturing of individual compartments while achieving comprehensive EMI shielding across the entire device.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Instead of forming shielding layers on top of the encapsulant after complete assembly, the invention inverts the approach by integrating conductive shielding layers directly into the encapsulant structure during the molding process, and by placing components within pre-formed shielded compartments rather than adding shields afterward.

Inventive Principle:

Principle #13The other way round (Inversion)

2Object-affected harmful factors

If trenching of encapsulant and deposition of metal is performed for intra-package shielding, then EMI shielding is improved, but manufacturing cost increases

Engineering Contradiction:

Improveintra-package interferenceVSAvoidmanufacturing cost

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The invention merges the encapsulant molding process with the shielding layer formation by integrating conductive materials directly into the encapsulant during injection molding. This combines multiple manufacturing steps into one, eliminating the need for separate trenching and metal deposition operations, thereby reducing manufacturing cost while maintaining effective intra-package shielding.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The encapsulant serves multiple functions simultaneously: it provides mechanical protection, thermal management, and EMI shielding. By integrating conductive shielding properties into the encapsulant material itself, the structure performs both structural and electromagnetic shielding roles, eliminating the need for separate shielding components and reducing overall manufacturing cost.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If encapsulant is used for component encapsulation, then component protection is achieved, but thermal release is limited

Engineering Contradiction:

Improvecomponent protectionVSAvoidthermal release

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The invention applies local quality by creating different thermal pathways within the encapsulant structure. While the encapsulant provides overall component protection, specific regions are designed with enhanced thermal conductivity or thermal release channels that allow heat to escape from critical components, thereby maintaining both protection and thermal management.

Inventive Principle:

Principle #3Local quality

4Object-affected harmful factors

If shielding layer is formed on molding compound, then EMI shielding is achieved, but durability decreases due to peeling

Engineering Contradiction:

ImproveEMI shieldingVSAvoidshielding layer durability

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

The invention addresses the peeling issue by creating an asymmetric bonding structure where the conductive shielding layer is integrated into the encapsulant matrix with enhanced adhesion on one side while maintaining shielding functionality. This asymmetric integration prevents the layer from detaching while preserving EMI shielding performance.

Inventive Principle:

Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies the shielding process, reduces manufacturing complexity, improves thermal performance, and enhances durability, thereby reducing manufacturing costs and interference issues.

Implementation Method 1

Methodology Applied

Scientific EffectFaraday cage: Faraday Cage

Data Source

PatentUS12412792B2Compartment shielding with metal frame and cap

Publication Date: 2025.09.09 STATS CHIPPAC LTD

AI summary

A semiconductor device has a substrate and a first semiconductor die disposed over the substrate. A first metal frame is disposed over the substrate around the first semiconductor die. A first metal lid is disposed over the first metal frame. A flap of the first metal lid includes an elastic characteristic to latch onto the first metal frame. An edge of the flap can have a castellated edge. A recess in the first metal frame and a protrusion on the first metal lid can be used to latch the first metal lid onto the first metal frame. A second metal frame and second metal lid can be disposed over an opposite surface of the substrate from the first metal frame.