Electronic Component Metal Frame Surface Unevenness
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Solution Overview
Problem
Conventional multilayer capacitors face challenges in maintaining high reliability due to direct heat and mechanical stress transmission from the substrate, which can lead to reduced durability and increased defect rates, especially in applications requiring high heat resistance and vibration resistance like eco-friendly vehicles.
Innovation Solution
The electronic component incorporates a metal frame with a surface unevenness portion at the interface with an encapsulant, enhancing bonding strength and moisture resistance by increasing the interfacial area and preventing direct stress transmission, while maintaining mechanical integrity through conductive adhesive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal frame is bonded to a side surface of the multilayer capacitor to secure a gap between the multilayer capacitor and the mounting substrate, then stress transmission from the substrate is reduced, but bonding strength between the metal frame and insulating resin becomes insufficient
Solution Approach 1:
The patent applies local quality by creating surface unevenness only at the bonding interface between the metal frame and insulating resin, while keeping other portions of the metal frame smooth. This localized modification increases the bonding strength precisely where needed without affecting other functions of the metal frame, such as providing a gap for stress isolation.
Solution Approach 2:
The patent introduces surface curvature/roughness to the bonding interface of the metal frame. The uneven surface creates a mechanically interlocked structure with the insulating resin, similar to how curved or rough surfaces increase contact area and adhesion. This curvature effect enhances the bonding strength while maintaining the overall flat structure needed for stress isolation.
2Strength
If the surface of the metal frame at the bonding interface is made rougher to increase bonding strength, then adhesion to the encapsulant improves, but the structural integrity of the metal frame may be compromised
Solution Approach 1:
The patent applies local quality by creating surface unevenness only at the bonding interface between the metal frame and insulating resin, while keeping other portions of the metal frame smooth. This localized modification increases the bonding strength precisely where needed without affecting other functions of the metal frame, such as providing a gap for stress isolation.
Solution Approach 2:
The patent applies partial action by modifying only the necessary portion of the metal frame surface (the bonding interface) rather than the entire surface. This selective modification achieves the required bonding strength enhancement while minimizing the impact on the overall structural integrity of the metal frame.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the durability and reliability of the electronic component by reducing moisture penetration and maintaining mechanical strength, resulting in lower defect rates and enhanced heat dissipation, even under external forces.
Implementation Method 1
a surface unevenness portion disposed on at least a portion of an interface with the encapsulant
Data Source
AI summary
An electronic component includes a capacitor component including a body and an external electrode disposed outside the body; a metal frame connected to the external electrode; and an encapsulant at least partially covering regions of the capacitor component and the metal frame. The metal frame may include a surface unevenness portion disposed on at least a portion of an interface with the encapsulant.