Metal Frames with Insulating Layers for Acoustic Noise Reduction

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Solution Overview

Problem

Conventional electronic components with metal frames used to reduce acoustic noise are prone to short circuit defects due to misalignment during mounting, as the metal frames can contact adjacent land patterns, leading to electrical shorts.

Innovation Solution

The electronic component design includes first and second metal frames with support and mounting portions, and insulating layers on the external surfaces of these frames, ensuring they are spaced apart from the body and external electrodes, preventing contact with adjacent components during mounting, and featuring a nickel and tin plating layer for enhanced insulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a metal frame is used to prevent vibration transfer and reduce acoustic noise, then acoustic noise is reduced, but the metal frame may contact adjacent land patterns during mounting causing short circuit defects

Engineering Contradiction:

Improveacoustic noiseVSAvoidshort circuit defect

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

An insulating layer is introduced as an intermediary between the metal frame and the external environment. This insulating layer covers the mounting portion and support portions of the metal frame, preventing direct contact between the conductive metal frame and adjacent land patterns on the substrate, thereby eliminating the short circuit risk while maintaining the vibration isolation function

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

A thin film insulating layer is applied to cover the metal frame's mounting portions and support portions. This thin film provides electrical insulation without significantly increasing the overall size, allowing the metal frame to maintain its vibration isolation function while preventing contact with adjacent conductive elements

Inventive Principle:

Principle #30Flexible shells and thin films

2Volume of moving object

If the metal frame is positioned closer to the body to reduce size, then device compactness is improved, but misalignment during mounting increases the risk of contact with adjacent components

Engineering Contradiction:

Improvedevice sizeVSAvoidmounting alignment

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

The insulating layer is applied in advance to the metal frame's mounting portions and support portions before mounting. This pre-applied insulating layer acts as a cushion or buffer that prevents direct contact between the metal frame and adjacent land patterns, compensating for potential misalignment during the mounting process

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The insulating layer serves as an intermediary barrier between the metal frame and the substrate's land patterns. Even if positioning deviations occur during mounting, this intermediary layer prevents electrical contact, thereby reducing the sensitivity to manufacturing precision requirements

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively prevents short circuit defects between components by maintaining the metal frames' separation from adjacent land patterns during mounting, while also reducing acoustic noise by minimizing vibration transfer, with insulating layers ensuring adequate electrical insulation.

Implementation Method 1

first and second insulating layers formed on external surfaces of the first and second support portions

Methodology Applied

Scientific EffectElectrical insulation: Electrical Resistance

Implementation Method 2

metal frames with insulating layers thereon... prevent the vibrations generated by the multilayer capacitor from being transferred to the substrate

Methodology Applied

Scientific EffectVibration isolation: Damping

Implementation Method 3

First and second conductive adhesive layers may be provided between the first and second connection portions of the first and second external electrodes and the first and second support portions

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS11037730B2Electronic component having metal frames with insulating layers thereon

Publication Date: 2021.06.15 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

An electronic component includes a body; first and second external electrodes including first and second connection portions and first and second band portions, respectively; and first and second metal frames connected to the first and second external electrodes, respectively, wherein the first and second metal frames include first and second support portions bonded to the first and second connection portions, and first and second mounting portions extended in the first direction from lower ends of the first and second support portions and spaced apart from the body and the first and second external electrodes, and further include first and second insulating layers formed on external surfaces of the first and second support portions.