Metal Encapsulant with Graphite Composite for Flexible Electronics

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Solution Overview

Problem

Flexible electronic devices, such as OLEDs, face challenges with moisture permeability and inefficient heat dissipation due to the use of plastic or polymer encapsulants, and existing metal encapsulants with superior moisture prevention and heat dissipation properties are costly to manufacture when formed into thin films.

Innovation Solution

A metal encapsulant with a metal foil thickness of 8 μm to 100 μm, featuring a coating layer with a metal-graphite composite (5% to 20% by weight) and a heat conductive layer with a metal-graphene composite (5% to 20% by weight), enhancing heat dissipation and moisture resistance while maintaining economic feasibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If metal encapsulants are formed into thin films (20-50 μm) using electroforming method to reduce manufacturing costs, then manufacturing cost decreases, but heat dissipation properties decline due to decreased heat capacity

Engineering Contradiction:

Improvemanufacturing costVSAvoidheat dissipation properties

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The patent applies composite materials by combining metal foil with polymer materials having high heat capacity (such as polyimide or polyetheretherketone) to create a composite encapsulant structure. This composite structure maintains thin film thickness (20-50 μm) for cost-effective manufacturing while the high heat capacity polymer material compensates for the reduced heat dissipation capability, ensuring effective heat management in flexible electronic devices.

Inventive Principle:

Principle #40Composite materials

2Adaptability or versatility

If plastic or polymer materials are used as encapsulants to maintain flexibility, then flexibility is improved, but heat dissipation efficiency decreases

Engineering Contradiction:

ImproveflexibilityVSAvoidheat dissipation efficiency

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent uses composite materials combining metal foil with high heat capacity polymer materials to achieve both flexibility and effective heat dissipation. The metal foil provides structural support and conductivity, while the polymer matrix ensures flexibility and contributes high heat capacity for thermal management.

Inventive Principle:

Principle #40Composite materials

3Temperature

If metal encapsulants are used to improve heat dissipation and moisture prevention, then heat dissipation properties are improved, but manufacturing cost increases when formed into thin films

Engineering Contradiction:

Improveheat dissipation propertiesVSAvoidmanufacturing cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent employs composite materials that combine metal foil with cost-effective high heat capacity polymers, enabling the production of thin film encapsulants (20-50 μm) that provide superior heat dissipation and moisture prevention while maintaining economic feasibility through the electroforming manufacturing process.

Inventive Principle:

Principle #40Composite materials

4Ease of manufacture

If metal encapsulants are formed into excessively thin films to reduce cost, then manufacturing cost decreases, but heat capacity decreases leading to poor heat dissipation

Engineering Contradiction:

Improvemanufacturing costVSAvoidheat capacity

Core Design Contradiction:

Ease of manufactureVSQuantity of substance

Solution Approach 1:

The patent applies composite materials where high heat capacity polymer materials (such as polyimide or polyetheretherketone) are combined with metal foil in a thin film structure (20-50 μm). The polymer matrix provides high heat capacity to compensate for the reduced metal content, ensuring adequate thermal energy absorption capability while maintaining thin profile and cost-effectiveness.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The metal encapsulant effectively releases heat generated inside devices, preventing failures caused by heat accumulation and maintaining flexibility, while reducing manufacturing costs by optimizing the thickness and composition of the metal-graphite and metal-graphene composites.

Implementation Method 1

a coating layer which is formed on one surface of the metal foil and includes a main resin and a metal-graphite composite

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a heat conductive layer with a metal-graphene composite (5% to 20% by weight)

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10044003B2Metal encapsulant having good heat dissipation properties, method of manufacturing same, and flexible electronic device encapsulated in said metal encapsulant

Publication Date: 2018.08.07 POHANG IRON & STEEL CO LTD

AI summary

The present invention relates to a metal encapsulant having good heat dissipation properties, a method of manufacturing same, and a flexible electronic device encapsulated in said metal encapsulant, and particularly, to a metal encapsulant having excellent flexibility, moisture resistance, workability, and heat dissipation properties by forming a coating layer including a metal graphite composite on one surface thereof, to a method of manufacturing same, and a flexible electronic device encapsulated in said metal encapsulant.