Metal Heater with Embedded Resistive Heaters
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Solution Overview
Problem
Conventional metal heaters used in semiconductor device manufacturing face challenges in achieving precise and uniform temperature control due to gaps between the resistive heating elements and the substrate, leading to non-uniform heating and temperature variations.
Innovation Solution
A metal heater design featuring a metal substrate with grooves for embedding resistive heaters and filling with a low-melting-point fill metal, such as indium, which solidifies to provide direct contact and enhance heat transfer, while the substrate remains solid during operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cartridge heaters with ceramic cores and MgO insulation are used, then the heater structure is simple to manufacture, but gaps form between the heating element and substrate leading to non-uniform heating
Solution Approach 1:
The patent changes the physical state parameter of the fill metal from solid to liquid during operation. The fill metal is selected to melt at operating temperatures, transforming from a solid that cannot fill gaps to a liquid that flows and conforms to the substrate surface, eliminating voids and ensuring uniform thermal contact.
Solution Approach 2:
The patent utilizes the phase transition of the fill metal from solid to liquid state. During heater operation, the fill metal melts and fills gaps between the heating element and substrate, then maintains liquid state to ensure continuous thermal contact. This phase transition directly resolves the gap formation problem while maintaining structural simplicity.
2Strength
If the metal substrate is made solid to maintain structural integrity, then mechanical strength is ensured, but heat transfer to the substrate is reduced due to gaps
Solution Approach 1:
The patent introduces a fill metal intermediary substance between the heating element and substrate. This fill metal serves dual functions: it maintains the solid substrate's structural integrity while simultaneously improving heat transfer by filling gaps and conforming to surfaces, acting as a thermal bridge that enhances contact without compromising mechanical strength.
Solution Approach 2:
The patent creates a composite thermal interface system consisting of the solid metal substrate, the resistive heating element, and the liquid fill metal. This composite structure combines the mechanical strength of the solid substrate with the thermal contact benefits of the liquid fill metal, achieving both structural integrity and efficient heat transfer.
3Temperature
If resistive heaters are embedded directly in the substrate, then heat transfer is maximized, but manufacturing precision is compromised due to difficulty in achieving uniform contact
Solution Approach 1:
The patent introduces dynamic adaptability to the thermal interface system. The liquid fill metal dynamically adjusts its shape and volume to conform to the substrate surface and heating element geometry, automatically compensating for manufacturing tolerances and surface irregularities. This dynamic adaptation eliminates the need for high manufacturing precision while maintaining optimal thermal contact.
Solution Approach 2:
The liquid fill metal performs self-adjustment and self-leveling functions. When heated to melting point, it automatically flows to fill gaps and conforms to the substrate surface without requiring external intervention or precision alignment. This self-service capability ensures uniform thermal contact while accommodating manufacturing variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures enhanced heat transfer and uniform heating by maintaining the substrate solid and allowing the fill metal to melt and expand, filling gaps and improving thermal contact, thus achieving precise temperature control.
Implementation Method 1
the fill metal is allowed to melt and expand, filling gaps and improving thermal contact
Implementation Method 2
the fill metal is allowed to melt and expand, filling gaps and improving thermal contact
Implementation Method 3
resistive heating elements and the substrate, leading to non-uniform heating and temperature variations
Data Source
AI summary
A metal heater includes a metal substrate with a groove, a resistive heater disposed within the groove, and a fill metal disposed over the resistive heater and substantially filling the groove, wherein the fill metal has a lower melting temperature than the metal substrate. The fill metal can be indium and a cover plate can be bonded to the metal substrate and over the indium. A method of manufacturing the metal heater and a method of operating the metal heater are also provided.