Metal IC Card Support Structure for Heavier Feel and Insulation

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Solution Overview

Problem

Existing IC cards with metal layers lack a solid and heavy feel, which is desirable for enhancing user perception.

Innovation Solution

The IC card incorporates a metal support member with a cavity and slit, accommodating an IC module within a through hole in a metal plate, using a metal with higher specific gravity and ensuring insulation to enhance weight and feel.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a metal layer is used in the IC card, then the magnetic coupling is improved, but the solid and heavy feel is not achieved

Engineering Contradiction:
Improvemagnetic couplingVSAvoidweight
Core Design Contradiction:
ReliabilityVSWeight of stationary object

Solution Approach 1:

The support member is integrated with the metal plate to form a unified structure, combining the magnetic properties of the metal layer with the structural support function. This merging allows the support member to contribute to both magnetic coupling and the solid/heavy feel without requiring separate heavy components.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The IC card employs a composite structure combining the metal plate with the support member having higher specific gravity. This composite approach allows the support member to provide additional weight and solid feel while the metal plate maintains the magnetic coupling properties.

Inventive Principle:
Principle #40Composite materials

2Weight of stationary object

If a support member with cavity and slit is used, then the solid and heavy feel is enhanced, but the device complexity increases

Engineering Contradiction:
ImproveweightVSAvoidstructure complexity
Core Design Contradiction:
Weight of stationary objectVSDevice complexity

Solution Approach 1:

The support member is designed with a cavity that segments the internal space, allowing the IC module to be accommodated within while maintaining the structural integrity and weight distribution needed for the solid/heavy feel.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The support member serves multiple functions: it provides structural support, accommodates the IC module through its cavity, contributes to the solid/heavy feel through its material composition, and maintains insulation through its slit design. This multi-functionality reduces the need for separate components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If the support member is separated from the metal plate, then the insulation is improved, but the stability decreases

Engineering Contradiction:
ImproveinsulationVSAvoidstability
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The slit in the support member acts as an intermediary structure that maintains separation from the metal plate, ensuring electrical insulation while the overall integrated design preserves structural stability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS20260010753A1IC card
Publication Date: 2026.01.08 TDK CORP
  • US20260010753A1 patent drawing
  • US20260010753A1 patent drawing
  • US20260010753A1 patent drawing

AI summary

An IC card includes a metal plate having a through hole penetrating therethrough in one direction, a metal support member disposed inside the through hole and separated from the metal plate, and an IC module supported inside the through hole by the support member. The support member has a cavity penetrating therethrough in the one direction and accommodating a part of the IC module and a slit extending from the cavity to a periphery thereof.