Metal Isolation Layer for Organic Substrate Protection in Flexible Displays
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Solution Overview
Problem
Conventional flexible display devices using organic material substrates face issues with poor water isolation, oxygen barrier, and heat resistance, leading to substrate damage during high-temperature processes like Eximer laser annealing, and the buffering layers deposited by PECVD have loose structures and poor pollution prevention.
Innovation Solution
An array substrate with a metal isolation layer between the organic substrate and the buffering layer, where the isolation layer is formed using titanium, aluminum, or copper materials to prevent plasma-induced pollution and heat conduction during high-temperature processes, and thin-film transistors with low-temperature polysilicon layers are integrated.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If PECVD method is used to deposit buffering layer at higher temperature, then water isolation and oxygen barrier effects are improved, but plasma directly bombards the organic substrate causing organic dust pollution
Solution Approach 1:
The patent introduces a metal isolation layer as an intermediary between the organic substrate and the PECVD buffering layer. This isolation layer acts as a protective mediator that absorbs plasma bombardment and prevents direct contact between plasma and the organic substrate, thereby eliminating organic dust pollution while allowing the PECVD process to proceed at higher temperatures for improved water isolation and oxygen barrier effects.
2Reliability
If PECVD method is used to deposit buffering layer at higher temperature, then water isolation and oxygen barrier effects are improved, but the organic substrate suffers from heat damage
Solution Approach 1:
The metal isolation layer serves as a thermal mediator that protects the organic substrate from direct heat exposure during high-temperature PECVD processes. This intermediary layer enables the deposition to proceed at higher temperatures necessary for forming dense buffering layers with good water isolation and oxygen barrier properties, while preventing thermal damage to the temperature-sensitive organic substrate.
3Temperature
If thicker buffering layer is deposited to protect substrate during high-temperature processes, then substrate protection is improved, but the structure becomes looser and pollution prevention worsens
Solution Approach 1:
The metal isolation layer provides effective substrate protection during high-temperature processes, eliminating the need for excessively thick buffering layers. By placing this protective intermediary between the substrate and the PECVD process, the buffering layer can be deposited at optimal thickness with dense structure, thereby improving both substrate protection and pollution prevention capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The metal isolation layer effectively prevents substrate pollution and heat conduction, enhancing the structural integrity and performance of the array substrate and display device by reducing heat transfer and plasma bombardment effects.
Implementation Method 1
in the deposition process, the plasma bombards the organic material substrate directly such that an organic dust will pollute the device cavity and the pipeline
Implementation Method 2
the isolation layer can also decrease a heat conduction from an external environment to the substrate so as to protect the substrate
Implementation Method 3
through a magnetron sputtering to deposit the titanium material on the substrate
Data Source
AI summary
An array substrate is disclosed. The array substrate includes: a substrate adopting an organic material; an isolation layer adopting a metal material, and the isolation layer is formed on the substrate; and a buffering layer formed at a side of the isolation layer away from the substrate. In the array substrate of the present invention, in a high-temperature PECVD process, a pollution problem caused by the plasma directly bombarding the substrate made of an organic material can be avoid. A display device applying the array substrate and a manufacturing method for an array substrate are also disclosed.