Metal Laminate Production via Partial Oxide Retention Sputtering
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for producing metal laminate materials require extensive sputter etching to remove oxide layers, leading to reduced production efficiency, especially in continuous production processes.
Innovation Solution
Sputtering treatment is conducted with inert gas ions under conditions that allow partial retention of oxide layers on the bonding surfaces, followed by thermal treatment to enhance bonding strength, significantly reducing production time and improving productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If complete removal of oxide layers is conducted by sputter etching treatment, then bonding strength is improved, but production time is increased
Solution Approach 1:
The patent applies partial action by conducting sputter etching treatment that removes only a portion of the oxide layers rather than completely removing them. The treatment conditions are controlled to achieve sufficient bonding strength while retaining some oxide layers, thereby reducing the required treatment time and improving production efficiency
Solution Approach 2:
The patent changes the parameters of sputter etching treatment (such as treatment time, power, gas flow rate) to optimize the balance between oxide layer removal and production time. By adjusting these parameters, the process achieves adequate surface activation for bonding without requiring complete oxide layer removal, thus reducing production time
2Strength
If sputter etching treatment is extended to completely remove oxide layers, then bonding strength is improved, but productivity is reduced
Solution Approach 1:
The patent implements partial action by using sputter etching treatment that partially removes oxide layers rather than completely removing them. This partial treatment is sufficient to activate the surfaces for bonding while significantly reducing the treatment duration, thereby maintaining bonding strength while improving productivity in continuous production processes
Solution Approach 2:
The patent enables continuous production by optimizing the sputter etching treatment to achieve effective surface activation in a shortened time frame. The treatment parameters are adjusted to provide continuous useful action that prepares surfaces for bonding without requiring extended treatment times, thus maintaining high productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances bonding strength while significantly reducing production time, increasing productivity by allowing partial retention of oxide layers and optimizing thermal treatment conditions.
Implementation Method 1
sputtering treatment with inert gas ions under conditions where oxide layers present on the faces to be bonded are not completely removed
Implementation Method 2
conducting a predetermined thermal treatment after temporary bonding is conducted
Data Source
Figure 1(1)~1(4)
Figure 2
Figure 3
AI summary
An object of the present invention is to provide a method for producing a metal laminate material that maintains sufficient bonding strength and has superior production efficiency. A method for producing a metal laminate material by bonding two sheets, one sheet composed of a material M1 and the other sheet composed of a material M2, wherein each of M1 and M2 is a metal or alloy comprising any one or more selected from the group consisting of Mg, Al, Ti, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Pd, Ag, In, Sn, Hf, Ta, W, Pb, and Bi, comprises the steps of: subjecting the faces of the two sheets to be bonded to sputtering treatment with inert gas ions under vacuum such that oxide layers on surface layers remain; temporarily bonding the two sheets by roll pressure bonding; and conducting a thermal treatment to thereby bond the two sheets, and, when Tm1 > Tm2 where Tm1(K) is the melting point of M1 and Tm2(K) is the melting point of M2, the temperature of the thermal treatment is 0.45Tm2 or more and less than 0.45Tm1, provided that the temperature is not more than Tm2.