Metal Layer Bubble Removal in Flexible Display Manufacturing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The manufacturing process of flexible display devices often results in bubbles forming between the flexible substrate and the carrier substrate, which are difficult to remove effectively, affecting the quality and reliability of the display device.
Innovation Solution
A method involving the formation of a metal layer on the carrier substrate, laminating a display substrate, heating the metal layer to react with and solidify the bubbles, and subsequently separating the substrates, with the option to use a gas inflow blocking agent to enhance bubble removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a flexible substrate is laminated on a carrier substrate during thin film processing, then the substrate can be processed, but bubbles form between the substrates that are difficult to remove
Solution Approach 1:
A metal layer is formed on the carrier substrate before laminating the flexible substrate. This preliminary metal layer serves as a reactive layer that will later react with bubbles to remove them, preventing the bubble problem before it affects the final product quality
Solution Approach 2:
The bubbles that form between the substrates during lamination are converted from a harmful defect into a removable byproduct. The metal layer reacts with the bubbles (likely through oxidation or other chemical reactions), transforming the gas bubbles into solid reaction products that can be easily removed, thus converting the harmful bubble formation into a beneficial self-cleaning process
2Reliability
If the flexible substrate is temporarily attached to the carrier substrate, then processing can be performed, but the attachment creates bubbles that affect display device quality
Solution Approach 1:
The metal layer acts as an intermediary between the carrier substrate and the flexible substrate. During lamination, this intermediate layer facilitates controlled reaction with any bubbles that form, mediating the interaction between substrates to prevent bubble-related defects while maintaining the temporary attachment necessary for processing
Solution Approach 2:
The metal layer undergoes parameter changes through chemical reactions with the bubbles. By controlling the reaction conditions (temperature, atmosphere, reaction time), the metal layer transforms from its initial state to a reactive state that can effectively remove bubbles, then potentially to a final state suitable for substrate separation
3Ease of manufacture
If conventional lamination methods are used without additional layers, then the process is simple, but bubbles cannot be effectively removed
Solution Approach 1:
The carrier substrate is enhanced with a metal layer to create a composite structure. This composite material combines the mechanical properties of the carrier substrate with the chemical reactivity of the metal layer, achieving both structural support and bubble removal functionality without significantly complicating the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes bubbles between the flexible and carrier substrates, minimizing defects and ensuring a higher quality display device without damaging the flexible substrate.
Implementation Method 1
supplying a current to the metal layer to heat the metal layer
Data Source
AI summary
A method for manufacturing a display device includes forming a metal layer on a carrier substrate, laminating a display substrate on the metal layer, supplying a current to the metal layer to heat the metal layer, and separating the display substrate from the metal layer and the carrier substrate.